No damage to the substrate! A vacuum deposition device capable of ultra-low temperature sputtering.
We would like to introduce our "Opposing Target Sputtering Equipment." Argon plasma is confined between two opposing targets, and the confined argon plasma ejects target material onto a substrate positioned at a 90-degree angle to the targets. This allows for high-speed reactive sputtering, such as for oxide films. 【Features】 ■ No damage to the substrate: Ultra-low temperature sputtering is possible ■ Confined plasma: Low impedance even in high vacuum ■ Reactive gases (such as O2) are difficult to enter the plasma: Enables high-speed reactive sputtering for oxide films and more *For more details, please download the PDF or feel free to contact us.
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basic information
【Examples of Achievements (Mass Production Machines)】 <4-Layer Inline Type> ■Board: Max 400×400 ■Target: 500L×150H×5t ■Expandable up to 8 layers <2-Layer Roll to Roll Type> ■Board: Max film width 1000 ■Target: 1000L×150H×5t ■2-layer film *For more details, please download the PDF or feel free to contact us.
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Applications/Examples of results
【Example of Achievements (Experimental Equipment)】 <4-Layer Carousel Type> ■Board: 80×80 max ■Target: 100 ■Sputtering Gas: 4 systems ■Power Supply: DC 3KW with 4-point switch ■Exhaust System: Turbo Molecular Pump 450L/min *For more details, please download the PDF or feel free to contact us.
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Company information
The necessity of thin film production in next-generation technologies is increasing more and more. In thin film production, there is a demand for technology that is low-temperature, dense, and also highly productive. Our company has made it possible to implement arc discharge measures that were not achievable with conventional opposing target sputtering methods, and we manufacture and sell uniform plasma sputtering devices that meet the above conditions.
