You can perform inspections in IR bright field and dark field using adjustments to infrared light illumination.
Non-destructive monitoring and inspection of internal defects in infrared-transmitting materials such as semiconductor wafers can be performed simultaneously with visible and infrared images, allowing for the detection of pattern misalignment and internal defects. The surfaces of TSV through-silicon vias and stacked wafers can be monitored simultaneously with visible imaging and IR focus adjustment to observe the interior of the wafers. For more details, please download and view the catalog.
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【Features】 1. The optical system is based on the Nikon Eclipse microscope. 2. Visual inspection under visible light, color monitor inspection, and infrared monitor inspection can be performed simultaneously. 3. The focus of the visible camera and the infrared camera can be aligned. 4. The infrared focus position can be moved down to 1mm below the wafer while keeping the surface in focus. 5. Adjustments to the illumination of transmitted infrared light allow for inspections in IR bright field and dark field. ◎ You can view detailed specifications and more by downloading the catalog. If you are interested, please download and check the catalog.
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We will collaboratively think about and manufacture prototypes, automatic machines, and online machines for inspection equipment that supports the manufacturing and development of new technologies, tailored to your ideas and requests. We provide everything from the design and manufacturing maintenance of hardware, optical systems, and software for ordered products to after-sales service.
![[Technical Data] High-Throughput Screening of Surface Contamination](https://image.mono.ipros.com/public/product/image/216/2000769714/IPROS18107906307725572260.png?w=280&h=280)
