Use of a dicing device equipped with a rotating blade.
To accurately cut and chip the circuits formed on Si wafers, a technique called dicing is used. It is common to use a dicing device equipped with a rotating blade. At Toyowa Industry Co., Ltd., we handle processing not only for Si wafers but also for glass, ceramics, single crystal materials, resins, and more. Cutting water can be compatible with pure water. We support everything from prototype processing to mass production. Additionally, we can accommodate cutting methods tailored to your needs (such as scribing). For more details, please contact us or refer to our catalog.
Inquire About This Product
basic information
【Features】 ○ The use of dicing equipment with integrated rotating blades is mainstream. ○ Processing of Si wafers, glass, ceramics, single crystal materials, resins, etc. is also possible. ○ Cutting water can be compatible with pure water. ○ Support from prototype processing to mass production. ○ Cutting methods tailored to applications (such as scribing) are also available. 【Capabilities】 ○ Processing technologies: full cut, half cut, U-groove, V-groove processing. ○ Materials: various types of glass, ceramics, single crystal materials, resins, etc. ○ Shapes: round flat plates, square flat plates. ○ Outer dimensions: max φ12 inches (for Si wafers). ○ Substrate thickness: max 3 mm (for glass). ○ Polishing of glass and back grinding of Si wafers are also possible. ○ Automatic chip tray packing is also possible. ● For more details, please contact us or refer to the catalog.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
【Usage】 ○ IC chips, various ceramic components, optical pickup components, various electronic components, cover glass, etc. ● For more details, please contact us or refer to the catalog.
catalog（1）
Download All Catalogs
Company information
In the future, as represented by MEMS, the research and development department will become indispensable in this industry, where higher precision and greater refinement are increasingly required. Our company will assist with prototyping and development using the know-how we have cultivated over many years. We look forward to inquiries from all industries, not just in the fields of electronics and optics.