Delivery Record: Information and Image Processing Equipment - High-Speed Serial Transmission System
It is possible to build a system with a low-speed to high-bandwidth serial bus using LVDS!
The high-speed serial transmission system can be constructed using LVDS, enabling systems with low-speed (Mbps) to high-bandwidth (Gbps) serial buses. It is designed for applications that require high-speed data communication through a distributed control system. As an example of development, there is a system that realizes a high-speed serial data bus (up to 1.25Gbps) using Xilinx's FPGA (such as Virtex5). This system consists of one master board and seven slave boards that communicate data rapidly through a backplane, with PowerPC CPUs adopted for each board and Linux as the operating system. 【Features】 ■ Uses LVDS → Capable of constructing systems with low-speed (Mbps) to high-bandwidth (Gbps) serial buses ■ Designed for applications requiring high-speed data communication through a distributed control system *For more details, please refer to the PDF document or feel free to contact us.
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【Example of Development】 ■High-speed serial data bus using Xilinx FPGA (such as Virtex5) → A system achieving up to 1.25Gbps ■A system where one master board and seven slave boards communicate data at high speed through a backplane ■PowerPC is adopted for the CPU of each board, and the OS is Linux *For more details, please refer to the PDF document or feel free to contact us.
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★ Both electrical design and mechanical design are supported, and the company continues to expand smoothly, with annual sales projected to increase from 9.7 billion yen last year to 12.5 billion yen this year (with the fiscal year ending this month). We have a total of 70 technical staff involved in various software designs such as measurement and control circuit design, image processing, mechatronics line design, and related peripheral designs, and the number of employees has exceeded 540. ★ Not only design but also sheet metal processing, machining, surface mounting, assembly, and inspection are in-house processes, ensuring short delivery times and high quality. In particular, we have equipment capable of handling large boards (500×600) and high-density boards (BGA, 0.5mm QFP) for circuit board assembly, and in the inspection process, we have equipment such as X-ray inspection machines and in-circuit testers. Additionally, we have renewed our equipment mainly at the Kumamoto, Hamamatsu, and Sagamihara factories. ★ In January 2015, we established the Sagamihara Division in addition to the Kyoto, Kumamoto, and Hamamatsu factories, creating a four-division structure, and in March 2016, new buildings began operations at the Kyoto and Kumamoto factories.