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  6. Burn-in socket / Fine pitch BGA, LGA for 77X series

Burn-in socket / Fine pitch BGA, LGA for 77X series

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77X Series Open Top Type Burn-In Socket

last updated:Sep 13, 2012

Boyd Technologies Japan 本社
Boyd Technologies Japan 本社
  • Official site

This is an open-top socket series with a rich lineup corresponding to each pitch of fine pitch BGA/LGA devices.

- We offer a wide range of variations for BGA/LGA devices with terminal pitches of 0.4mm, 0.5mm, 0.65mm, and 0.8mm. - This is an open-top type suitable for both automatic insertion and manual insertion of devices. - It employs a push-on surface mount method that makes it easy to remove from the substrate. - Some models utilize a full-pressure latch mechanism to prevent warping of devices at high temperatures. - It can also be used in environmental tests such as HAST and THB. - It achieves high contact performance while using inexpensive stamped contacts.

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773&772(1).JPG

Burn-in socket / Fine pitch BGA, LGA for 77X series

773&772(1).JPG
773&772(1).JPG
  • Related Link - http://www.wellscti.com/burn_in/csp-fbga/

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basic information

- Compatible terminal pitch: 0.4mm (series 772, 773), 0.5mm (series 774, 775), 0.65mm (series 774, 776), 0.8mm (series 774, 775) - Compatible device size: 2.0mm□ to 16x16mm□ - This is an open-top type suitable for both automatic and manual insertion and extraction of devices. - It adopts a press-fit surface mount method that makes it easy to remove from the circuit board. - Some varieties employ a full-contact latch mechanism to prevent warping of devices at high temperatures. - It can also be used in environmental tests such as HAST and THB. - It achieves high contact performance while using inexpensive punched contacts.

Price information

Prices vary depending on the variety and quantity, so please feel free to contact us.

Price range

P1

Delivery Time

Please contact us for details

※Delivery times may vary depending on quantity and variety, so please feel free to contact us.

Applications/Examples of results

Burn-in testing, various environmental tests, various programming.

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Model number overview
77X Series Fine Pitch BGA/LGA Open Top Socket Series

Company information

Boyd

Boyd Technologies Japan 本社

Electronic Components and Semiconductors

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SensorTa Technologies Japan, Inc., QINEX Division, joined the North American Boyd Corp group in August 2022 and became Boyd Technologies Japan LLC.

Product/Service List (19)

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