It can be used for various applications, from solder formation on the wafer to soldering of semiconductor chips, and even large-area soldering for power devices.
The "Fluxless Reflow Device RF Series" can perform reflow under reduced pressure without using flux. Compared to conventional reflow processes that use flux, it eliminates the need for flux application and cleaning processes, reducing costs by approximately 50% and allowing for a reduction in installation space to about one-third. Additionally, it can reduce CO2 emissions generated during flux cleaning by about 30%, contributing to a decrease in environmental impact. Furthermore, due to the vacuum process, it can be processed without voids. For more details, please download the catalog or contact us.
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basic information
【Lineup】 ○ Manual device with one process chamber RF-310 → Enables a series of processes including vacuum pumping, formic acid reduction treatment, heating, and cooling within a single vacuum chamber at low cost. ○ Semi-automatic device with one process chamber RF-400 → Reduces takt time and improves throughput. ○ Fully automatic device with three process chambers RF-500 → Achieves maximum throughput. → Supports Φ300mm wafer transport. ○ Fully automatic inline device RF-520IL → Compatible with wafer and substrate processing, suitable for mass production. ○ Fully automatic device with one process chamber RF-530 → Supports tray transport and allows processing of multiple substrates at once. ● For more details, please download the catalog or contact us.
Price information
For more details, please contact us.
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Applications/Examples of results
【Applications】 ○ Solder molding ○ Solder ball mounting ○ Solder sheet connection (for power devices) ○ CoW/CoS connection ○ LED packaging Others For more details, please contact us.
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Company information
The roots of our technology lie in vacuum. In particular, vacuum sealing technology is a crucial final process that affects the quality of LSI and electronic components. Our vacuum sealing equipment has achieved this with high precision, low cost, and high yield, leading to its adoption by major semiconductor manufacturers and marking the beginning of high recognition for our technology.
