Fluxless Reflow Device SR-300
This is a device characterized by performing reflow under reduced pressure using formic acid without the use of flux. 【Features】 ○ No need for flux application or cleaning processes. ○ Approximately 50% cost reduction is possible, and the installation space can be reduced to about one-third. ○ It can contribute to reducing environmental impact by decreasing CO2 emissions generated during flux cleaning by about 30%. ● For more details, please contact us or download the catalog.
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basic information
This is a device characterized by performing reflow under reduced pressure using formic acid without the use of flux. 【Features】 ○ No need for flux application or cleaning processes. ○ Approximately 50% cost reduction is possible, and installation space can be reduced to about one-third. ○ CO2 emissions generated during flux cleaning can be reduced by about 30%, contributing to lower environmental impact. ● For more details, please contact us or download the catalog.
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The roots of our technology lie in vacuum. In particular, vacuum sealing technology is a crucial final process that affects the quality of LSI and electronic components. Our vacuum sealing equipment has achieved this with high precision, low cost, and high yield, leading to its adoption by major semiconductor manufacturers and marking the beginning of high recognition for our technology.
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