Selected mechanisms and specific examples of solutions to problems related to thermal expansion and contraction. To utilize countermeasures in the field, simulation and measurement techniques are also explained.
○Publication Date: September 27, 2012 ○Format: B5 size hardcover, 235 pages ○Price: 60,000 yen (excluding tax) → 56,952 yen (excluding tax) for STbook members ○Authors: Yoshihiko Imanaka, Fujitsu Laboratories Ltd. Toshiaki Ogasawara, Tokyo Institute of Technology Tetsuya Morimoto, JAXA Kazuichi Hoshikawa, Nihon University Masaru Ishizuka, Toyama Prefectural University Koji Takenaka, Nagoya University Koji Sugiura, Toa Gosei Co., Ltd. Yasuhisa Nishi, Denki Kagaku Kogyo K.K. Masatoshi Hasegawa, Toho University Nobuaki Takanezawa, Hitachi Chemical Co., Ltd. Takashi Nishimura, Mitsubishi Electric Corporation Hiroshi Kikuchi, Hitachi, Ltd. Yoshihide Takeyama, Genesia Inc. Masafumi Mori, Central Research Institute of Electric Power Industry Toru Ichitaku, ANSYS Japan Co., Ltd. Takuya Hashimoto, Nihon University Nobiaki Okubo, SII Nanotechnology Inc.
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Chapter 1: Overview of Issues and Countermeasures Related to Thermal Expansion and Contraction Section 1: Issues Caused by Thermal Expansion and Contraction in the Field of Microelectronics Packaging Section 2: Mechanisms of Thermal Expansion in Polymers and Mitigation Strategies Section 3: Countermeasures for Thermal Expansion and Contraction through Composite Materials Section 4: Countermeasures for Thermal Expansion and Contraction through the Development of Design Technologies Chapter 2: Material Development and Design Improvements for Thermal Expansion and Contraction Countermeasures Section 1: Control of Thermal Expansion Using Negative Thermal Expansion Materials Section 2: Development of Negative Thermal Expansion Fillers Section 3: Spherical Silica for Reducing Warpage and Thermal Expansion Section 4: Low Thermal Expansion Heat-Resistant Resins and Their Application to Transparent Plastic Substrates Section 5: Low Thermal Expansion Substrates Utilizing Stacking Effects Section 6: High Thermal Conductivity Organic Materials in Packaging Technology Section 7: Examples of Thermal Expansion and Contraction Countermeasures in Semiconductor Packages and Techniques for Reducing Warpage During Image Sensor Chip Packaging Section 8: Design Improvements for Optical Lenses: Designing Optical Instruments Considering Temperature Aberrations Section 9: Material Development for SOFC Considering Thermal Expansion Chapter 3: Simulation and Measurement of Thermal Expansion and Contraction Section 1: Various Thermal Design Analysis Techniques Using CAE Section 2: Mechanisms of Thermal Expansion and Contraction Measurement Methods Section 3: Analysis Devices for Expansion and Contraction Rates
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Main body 60,000 yen + tax → STbook members: 56,952 yen + tax
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S&T Publishing publishes technical books aimed at researchers and engineers.