Book: Mechanisms of Organic/Metal and Inorganic Interfaces - Factors Influencing Adhesion and Functionality
Understanding phenomena occurring at interfaces! To avoid solely focusing on troubleshooting: Understand the governing factors of bonding, temperature, electronic states, and methods for interface control!
○Publication Date: October 31, 2006 ○Format: B5 size, hardcover, 353 pages ○Price: 60,000 yen (excluding tax) → STbook member price: 56,952 yen (excluding tax) ○Authors: Motohiro Mito, Osaka City University / Hiroshi Ichimura, Kanagawa Institute of Technology / Shigeru Tasaka, Shizuoka University / Toshimitsu Nagao, Okuno Pharmaceutical Industry Co., Ltd. / Shigeyoshi Maeda, Nippon Steel Technical Information Center / Haruki Okumura, Toray Research Center, Inc. / Nobuo Ueno, Chiba University / Manabu Enoki, University of Tokyo / Akira Iwamori, Kanazawa University / Takashi Yamanishi, Nippon Mining & Metals Co., Ltd. / Hidemitsu Nawafune, Konan University / Kensuke Akamatsu, Konan University / Shingo Ikeda, Konan University / Eiji Otsubo, Mitsui Chemicals, Inc. / Katsufumi Hiraishi, Nippon Steel Chemical Co., Ltd. / Kikuo Kishimoto, Tokyo Institute of Technology / Masaki Omiya, Tokyo Institute of Technology / Takahiro Nakahigashi, Japan ITF, Inc. / Takayuki Miyamae, National Institute of Advanced Industrial Science and Technology / Hiroyuki Iwashita, Toyo Kohan Co., Ltd. / Toshio Ogawa, Kanazawa Institute of Technology / Masatoshi Tabei, ULVAC, Inc. / Takafumi Iida, Nagase ChemteX Corporation / Naoto Nakaya, Japan Avionics, Inc. / Kazuhito Mitsuishi, Okayama Prefectural Industrial Technology Center / Kosuke Haraga, Mitsubishi Electric Corporation
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basic information
Chapter 1: Adhesion Mechanisms of Organic/Metal and Inorganic Materials Chapter 2: Adhesive Strength and Composite Hardness Chapter 3: Thermal Properties of Metal/Polar Polymer Interfaces Chapter 4: Bonding States of Resin/Plating and Factors Affecting Stress and Adhesion Chapter 5: Chemical Bonding and Acid-Base Reactions of Resin/Metal and Metal Oxide Films Chapter 6: Analytical Methods for Organic/Metal and Inorganic Interfaces by Purpose Chapter 7: Fundamentals of Electronic States at Organic Thin Film Surfaces and Interfaces Chapter 8: Adhesion Evaluation of Si/Organic Thin Film Interfaces Chapter 9: Surface/Interface States and Adhesion Strength Evaluation of Metal/Organic Thin Films Chapter 10: Factors Affecting Adhesion and Evaluation of Rolled/Electrolytic Copper Foil and Resin Chapter 11: Adhesion Mechanisms of Copper/Polyimide Chapter 12: States and Adhesion of Copper/Polyimide Interfaces by Casting and Lamination Methods Chapter 13: States and Adhesion of Copper/Polyimide Interfaces by Sputtering Chapter 14: Development Trends of LCP−CCL Chapter 15: Interface Adhesion Strength of PET/Ceramics Thin Films (ITO) Chapter 16: States and Adhesion of PET/DLC Interfaces Chapter 17: Evaluation of Oxide/Polymer Interface States Using Harmonic Generation Method Chapter 18: Film Adhesion in PET Laminated Steel Sheets Chapter 19: States and Adhesion of Polyolefin/Metal Interfaces ~Chapter 24
Price information
Main unit 60,000 yen + tax → STbook member price: 56,952 yen + tax
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P2
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P2
Applications/Examples of results
Metal, interface
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S&T Publishing publishes technical books aimed at researchers and engineers.