Silver plating for semiconductors contributing to advanced industries through the light of brilliance.
Silver, which has excellent electrical conductivity, is suitable not only for soldering in semiconductors but also for bonding gold wires. Among metal materials, it has an outstanding reflectivity and is widely used in high-brightness LED packages with reflector surfaces. 【Features】 ○ Excellent electrical conductivity ・Suitable for soldering as well as bonding gold wires ○ Outstanding reflectivity among metal materials ・Widely used in high-brightness LED packages with reflector surfaces ● Advantages ・Low contact resistance ・Good bonding properties ● Disadvantages ・Discoloration due to sulfur (Countermeasure: sulfur prevention treatment) *For more details, please contact us or download the PDF.
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basic information
【Materials Suitable for Silver Plating】 ○Material: Copper, Copper Alloys, 42 Alloys, Iron ○Size: Plate thickness 0.1 to 2.0mm, Width 10 to 600mm ○Plating Specifications →Base: Copper, Nickel →Silver Gloss Level: Glossy, Semi-Gloss, Matte ●For more details, please contact us or refer to the catalog.
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Applications/Examples of results
【Usage】 ○ Suitable not only for soldering but also for bonding gold wires. ○ Frequently used in high-brightness LED packages with a reflector surface. ● For more details, please contact us or refer to the catalog.
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Company information
The Hygent Group focuses on five main areas of business: continuous plating processing, hermetic sealing processing, ceramics processing, precision machining, and etching. We continuously pursue the strength of the group as a whole and delve deeper into our specialties, with the slogan "Only the Best, Only the First" (a promise of the highest quality and excellence), to further serve you better.