ハイジェント Product Lineup

Our company is engaged in the "edible cricket business," which allows us to obtain efficient animal protein in a minimal rearing environment. Leveraging the characteristics of our main business as a precision machining manufacturer, we manage temperature and humidity, accumulate growth data, and conduct quality control equivalent to that of precision parts while raising crickets. The protein content is very high, around 70g per 100g, making it an excellent ingredient rich in omega-3 and omega-6 fatty acids, as well as vitamins A, D3, E, and C, providing essential nutrients for the human body all at once. 【Drying and Grinding (Powdering)】 ■ Dryer - We have introduced a mass production dryer that enables large-scale drying at once. - By using a mesh net, we can easily stir the crickets, which are the raw material. - We can also provide dried products (whole). ■ Grinder - Complete powdering. - We offer particle sizes tailored to customer applications. - During prototype testing, we conduct tests with multiple particle sizes to provide the most suitable powder. *For more details, please refer to the PDF materials or feel free to contact us.

• others

"PPAB" is an aluminum busbar with excellent characteristics manufactured by Nippon Light Metal Co., Ltd. It simultaneously achieves low cost and weight reduction while equipping the various functions required of a busbar. It contributes to improved energy efficiency through weight reduction and ensures a sustainable supply of inexpensive products using aluminum, which is abundant in resources. Additionally, by using recyclable materials, it can reduce waste emissions. 【Features】 ■ Aluminum is approximately 50% lighter than copper (based on conductivity) ■ Suppresses the increase in contact resistance due to aging ■ Low cost: Aluminum is stable and cheaper compared to copper ■ Flexible connectivity ■ Achieves low cost through a hoop-type continuous process from material to plating and pressing *For more details, please refer to the PDF document or feel free to contact us.

• Other metal materials

"Etching" not only implements etching processing but also various composite processing. When producing precision parts such as lead frames, etching processing is an option in addition to press processing. Under the collaborative system of the Highgent Group, we promise high quality and high precision from prototype production of a single item to small lot production and mass production. We also guarantee speedy manufacturing. 【Processing】 ■ Etching processing ■ Fiber laser processing ■ Diffusion bonding, thermal pressing, laser welding ■ Various rack plating, barrel plating *For more details, please refer to the external link page or feel free to contact us.

• Processing Contract

We are offering a free comprehensive catalog from our company, which specializes in hermetic seal processing! The catalog is filled with products that achieve high airtightness by blocking outside air, including "stems and caps for optical devices" used in conjunction with semiconductor element sealing, and "optical communication packages" compatible with high-speed, large-capacity communication. [Featured Products] ■ Stems and Caps for Optical Devices ■ Optical Communication Packages ■ Stems for Optical Semiconductors ■ Quartz Device Packages *For more details, please download the catalog or contact us.

• Ceramics

Hygent's "functional plating" is characterized by efficiently applying plating treatment to coiled metal materials and pressed materials in a continuous process. We have a variety of processing lines for continuous plating, allowing us to respond quickly to needs and requests. Please feel free to consult us about prototypes. 【Types of Plating】 ■ "Tin plating" suitable for connector terminals, etc. ■ "Reflow tin plating" that reduces risks from whiskers ■ "Nickel plating" suitable for aluminum wire bonding ■ "Gold plating" that contributes to core functions of safety devices ■ "Silver plating for semiconductors" that is perfect for soldering, etc. *For more details, please download the catalog or contact us. *Those who apply for the comprehensive catalog will receive the latest version in 2024.

• Plating Equipment

At Highgent, we offer a range of products including high-frequency packages that support optical communication technology, semiconductor lasers, industrial applications, and hermetic seal products for quartz oscillators that protect the heart of various industrial products. Leveraging our strengths in both glass and ceramics processing technologies, we flexibly pursue product development tailored to the characteristics of applications and materials. With stable quality and advanced airtightness and insulation, we guarantee hermetic seals that keep precision electronic components in optimal condition. Our package products boast exceptional precision and high quality, with "trust" and "safety" as key points. For more details, please contact us or refer to our catalog.

• Sealing

"Functional plating" refers to the process of applying plating (also known as electroplating) to various metal materials such as stainless steel, copper alloys, aluminum, and iron, in order to impart various properties, including electrical characteristics like conductivity and electromagnetic wave shielding, chemical characteristics such as corrosion resistance, and physical characteristics like reflectivity and hardness. At Highgent, we specialize in "continuous plating processing," which involves electrochemically depositing metal onto coil-shaped metal materials and pressed materials in a continuous process. Our processing line for continuous plating accommodates a variety of types, allowing us to respond quickly to customer requests and specifications. Additionally, by performing plating processing that attaches high-value metal materials like gold and silver to the surface of the base material, we can enhance value while reducing costs. For more details, please contact us or refer to our catalog.

• Surface treatment contract service

In addition to the glass hermetic metal packages adopted by many mainline optical communication repeaters, there is an increasing demand for high-frequency module packages that enable high-speed, large-capacity communication. By establishing technologies and facilities that cater to materials in both fields, Highgent is realizing optimal proposals tailored to applications. Armed with its cultivated ceramics manufacturing technology and know-how in bonding technology, the company is actively challenging the next-generation communication field and developing various products through custom-made solutions in areas beyond optical communication. For more details, please contact us or refer to our catalog.

• Processing Contract

Hygent Micro Co., Ltd. was established in 2011, based on the extensive experience and know-how in in-house manufacturing within the Hygent Group. We primarily produce advanced technology products used in various fields, including components for optical semiconductors, using high-precision processing machines. Utilizing micron-order precision machining technology, we can accommodate a wide range of customer requests, from tool development to the production of dedicated machines and improvements or new installations of production lines. In particular, we have an optimal production system for the precision machining of difficult-to-cut materials that require exceptional high precision and quality. We excel in processing nickel-containing difficult-to-cut materials such as Kovar and 42 Alloy (iron-nickel alloy), as well as copper tungsten and SUS materials. For more details, please contact us or refer to our catalog.

• Processing Contract

At Highgent, we offer a range of products, primarily high-frequency packages that support optical communication technology, as well as semiconductor lasers, industrial applications, optical sensors, and hermetic seal products for quartz oscillators that protect the heart of various industrial products. Leveraging our strengths in both glass and ceramics processing technologies, we flexibly pursue product development tailored to the characteristics of applications and materials. With stable quality and advanced airtightness and insulation, we promise reliable hermetic seals that keep precision electronic components in optimal condition at all times. The materials and finishes for optical semiconductor stems are as follows: Base: SPC/KOV, Heat Sink: SPC/Cu, Leads: Fe-Ni/KOV, Glass: Soft Glass/Hard Glass, Finish: Ni-EP/Ni-ELP+Au-P. For more details, please contact us or refer to our catalog.

• Sealing

At Highgent, we offer a range of products, primarily focusing on high-frequency packages that support optical communication technology, as well as semiconductor lasers, industrial applications, optical sensors, and hermetic seal products for quartz oscillators that protect the heart of various industrial products. Leveraging our strengths in both glass and ceramics processing technologies, we flexibly pursue product development tailored to the characteristics of applications and materials. With stable quality and high airtightness and insulation, we promise reliable hermetic seals that keep precision electronic components in optimal condition at all times. The materials and finishes for optical communication packages are as follows: Base: Cu-W/KOV, Leads: KOV, Feedthrough: Glass/Ceramics, Finish: Ni-EP+Au-P. For more details, please contact us or refer to our catalog.

• Sealing

At Highgent Co., Ltd., we primarily offer high-frequency packages that support optical communication technology, as well as glass terminals (stems) for semiconductor lasers, industrial applications, optical sensors, and hermetic seal products that protect the heart of various industrial products, such as quartz oscillators. Leveraging our strengths in both glass and ceramics processing technologies, we flexibly pursue product development tailored to the characteristics of applications and materials. We promise reliable hermetic seals that maintain precision electronic components in optimal condition through stable quality and advanced airtightness and insulation. [Specifications and Applications] - Optical communication packages - High-power lasers - Sensors *For more details, please contact us or refer to our catalog.

• Sealing

At Highgent, we offer a range of products, primarily focusing on high-frequency packages that support optical communication technology, including semiconductor lasers, industrial applications, optical sensors, and hermetic seal products for quartz oscillators that protect the heart of various industrial products. Leveraging our strengths in both glass and ceramics processing technologies, we flexibly pursue product development tailored to the characteristics of applications and materials. With stable quality and advanced airtightness and insulation, we guarantee reliable hermetic seals that keep precision electronic components in optimal condition. The materials and finishes for quartz device packages are as follows: Base: KOV/SPC, Lead: KOV, Glass: hard glass, Finish: Ni-ELP + Au-P/Ni-ELP + Solder Dip. For more details, please contact us or refer to our catalog.

• Sealing

In high-density mounting that responds to the miniaturization and high functionality of electronic components, measures to prevent the occurrence of whiskers (needle-like metal crystals) that cause circuit short circuits are a concern. Reflow tin plating can reduce the risks associated with whiskers. Specifications for materials that can be reflow tin plated are as follows: Material: Copper, copper alloys, SUS; full plating: thickness 0.8–1.2mm, width 10–300mm; partial plating: thickness 0.15–0.8mm, width 10–65mm; wire plating: size 0.35–1.2mm, round wire, square wire (flat square wire is also available); base materials: copper, nickel. For more details, please contact us or refer to the catalog.

• Surface treatment contract service

Tin plating, which excels in conductivity, solderability, and corrosion resistance, is suitable for connector terminals that require reliable and stable performance. At Highgent, we produce plating for various applications, including automotive, control panels for industrial equipment, and connector parts for white goods. The specifications for materials that can be tin plated are as follows: Material: copper, copper alloys, SUS, 42 alloy, iron, aluminum; full plating: thickness 0.08 to 2.5mm, width 8 to 300mm; partial plating: thickness 0.1 to 2.5mm, width 10 to 100mm; substrate types: copper and nickel. For more details, please contact us or refer to our catalog.

• Surface treatment contract service

Gold, known for its exceptional corrosion resistance and beautiful luster, is commonly used for decorative plating; however, at Highgent, we handle functional plating for connectors and other components. As the most stable metal, it contributes to core functions in safety devices such as automotive airbags, where reliable safety is essential, as well as in throttle control systems. Its advantages include low contact resistance and good bonding properties, while its disadvantages include high material costs (solution: partial plating). The specifications for materials that can be gold-plated are as follows: Material: copper, copper alloys, SUS, 42 alloy; Size: thickness 0.1 to 0.8 mm, width 10 to 60 mm; Base layer: copper, nickel; Composite plating: two-color plating with Sn and RSn. For more details, please contact us or refer to our catalog.

• Surface treatment contract service

Nickel plating, along with copper plating, forms a significant part of scientific plating due to its excellent resistance to high temperatures and high voltages, making it ideal for aluminum wire bonding and applications such as the production of high-voltage inverters. Its shiny appearance and superior corrosion resistance also make it commonly used for metal plating in memory card covers and electromagnetic wave shielding. The advantages include excellent heat resistance, corrosion resistance, wear resistance, and color stability, while the disadvantages include the tendency for thick, shiny plating with high hardness to crack during bending (countermeasure: thin matte plating). The specifications for materials that can be nickel plated are as follows: Material: copper, copper alloys, SUS, 42 alloys, iron, aluminum; full plating: thickness 0.08 to 2.5 mm, width 10 to 300 mm; partial plating: thickness 0.08 to 2.5 mm, width 10 to 290 mm. For more details, please contact us or refer to the catalog.

• Surface treatment contract service

Silver, with its high melting point, is suitable for parts around automotive engines that are exposed to high temperatures. Hard silver, which has increased hardness, is used in advanced applications in the electrical and electronic fields, including core components of high-tech products like hybrid engines. The specifications for materials that can be silver-plated are as follows: Material: Copper and copper alloys, Size: Thickness 0.1 to 1.5 mm, Width 10 to 150 mm, Center carrier type terminals can also be processed, Base: Copper and nickel, Multicolor plating: Sn plating and two-color plating. For more details, please contact us or refer to the catalog.

• Surface treatment contract service

Silver, which has excellent electrical conductivity, is suitable not only for soldering in semiconductors but also for bonding gold wires. Among metal materials, it has an outstanding reflectivity and is widely used in high-brightness LED packages with reflector surfaces. 【Features】 ○ Excellent electrical conductivity ・Suitable for soldering as well as bonding gold wires ○ Outstanding reflectivity among metal materials ・Widely used in high-brightness LED packages with reflector surfaces ● Advantages ・Low contact resistance ・Good bonding properties ● Disadvantages ・Discoloration due to sulfur (Countermeasure: sulfur prevention treatment) *For more details, please contact us or download the PDF.

• Surface treatment contract service