Nickel plating, which is widely used in electronic products, taking advantage of its luster and functional characteristics.
Nickel plating, along with copper plating, forms a significant part of scientific plating due to its excellent resistance to high temperatures and high voltages, making it ideal for aluminum wire bonding and applications such as the production of high-voltage inverters. Its shiny appearance and superior corrosion resistance also make it commonly used for metal plating in memory card covers and electromagnetic wave shielding. The advantages include excellent heat resistance, corrosion resistance, wear resistance, and color stability, while the disadvantages include the tendency for thick, shiny plating with high hardness to crack during bending (countermeasure: thin matte plating). The specifications for materials that can be nickel plated are as follows: Material: copper, copper alloys, SUS, 42 alloys, iron, aluminum; full plating: thickness 0.08 to 2.5 mm, width 10 to 300 mm; partial plating: thickness 0.08 to 2.5 mm, width 10 to 290 mm. For more details, please contact us or refer to the catalog.
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【Features】 ○ A large fortress of scientific plating along with copper plating ○ Excellent resistance to high temperatures and high voltages → Ideal for aluminum wire bonding → Utilized in the production of high-voltage inverters ○ Glossy appearance with excellent aesthetics and corrosion resistance → Also commonly used for metal plating for memory card covers and electromagnetic wave shielding ○ Advantages → Excellent heat resistance, corrosion resistance, wear resistance, and color stability ○ Disadvantages → High hardness glossy thick plating is prone to cracking during bending processes → Countermeasure: Thin matte plating 【Specifications for materials that can be nickel plated】 ○ Materials: Copper, copper alloys, SUS, 42 alloy, iron, aluminum ○ Full plating: Plate thickness 0.08 to 2.5mm, width 10 to 300mm ○ Partial plating: Plate thickness 0.08 to 2.5mm, width 10 to 290mm ● For more details, please contact us or refer to the catalog.
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Applications/Examples of results
【Usage】 ○ It is ideal for aluminum wire bonding and is used in the production of high-voltage inverters. ○ It is also commonly used as a metal plating for memory card covers and electromagnetic wave shielding. ● For more details, please contact us or refer to the catalog.
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Company information
The Hygent Group focuses on five main areas of business: continuous plating processing, hermetic sealing processing, ceramics processing, precision machining, and etching. We continuously pursue the strength of the group as a whole and delve deeper into our specialties, with the slogan "Only the Best, Only the First" (a promise of the highest quality and excellence), to further serve you better.
