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  6. Tin plating

Tin plating

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last updated:Oct 12, 2022

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Tin plating for automotive connectors and a wide range of applications in industrial and consumer use.

Tin plating, which excels in conductivity, solderability, and corrosion resistance, is suitable for connector terminals that require reliable and stable performance. At Highgent, we produce plating for various applications, including automotive, control panels for industrial equipment, and connector parts for white goods. The specifications for materials that can be tin plated are as follows: Material: copper, copper alloys, SUS, 42 alloy, iron, aluminum; full plating: thickness 0.08 to 2.5mm, width 8 to 300mm; partial plating: thickness 0.1 to 2.5mm, width 10 to 100mm; substrate types: copper and nickel. For more details, please contact us or refer to our catalog.

    Surface treatment contract service
05_suzu_mekki1.jpg

Tin plating

05_suzu_mekki1.jpg
05_suzu_mekki1.jpg
  • Related Link - http://www.hygente.com/products/mekki/suzu
  • Special site - Product/service details - https://pr.mono.ipros.com/hygente/product/

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【Features】 ○ Excellent conductivity, solderability, and corrosion resistance → Ideal for connector terminals where reliable and stable performance is always required ○ Produces plating for various applications, including automotive, control panels for industrial equipment, and connector parts for white goods 【Specifications for Tin Plating Materials】 ○ Materials: Copper, copper alloys, SUS, 42 alloy, iron, aluminum ○ Full plating: Thickness 0.08 to 2.5mm, Width 8 to 300mm ○ Partial plating: Thickness 0.1 to 2.5mm, Width 10 to 100mm ○ Base materials: Copper, nickel ● For more details, please contact us or refer to the catalog.

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【Applications】 ○ Suitable for connector terminals where reliable and stable performance is always required. ○ Producing plating for various applications, including automotive, control panels for industrial equipment, and connector parts for white goods. ● For more details, please contact us or refer to the catalog.

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Plating process: Tin plating / Reflow tin plating

Plating process: Tin plating / Reflow tin plating

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Electronic Components and Semiconductors

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The Hygent Group focuses on five main areas of business: continuous plating processing, hermetic sealing processing, ceramics processing, precision machining, and etching. We continuously pursue the strength of the group as a whole and delve deeper into our specialties, with the slogan "Only the Best, Only the First" (a promise of the highest quality and excellence), to further serve you better.

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