Touch panel laminating device
This is an assembly device that uses OCA for panel bonding. It attaches OCA sheets and performs bubble-free lamination using a unique lamination unit. During the attachment process, image processing alignment is conducted for positioning.
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basic information
It is a panel bonding device for smartphones, tablet PCs, and other devices. It bonds cover glass, switch boards, and 3D boards to the LCD substrate using the OCA method. By using a unique bonding unit, it enables stress-free, bubble-free bonding.
Price range
Delivery Time
Applications/Examples of results
Bonding of panels such as smartphones and tablet PCs.
Company information
Shinko Engineering Co., Ltd. has continuously created unique products in the design and manufacturing field of information and communication technology-related devices and systems since its establishment. In particular, we have consistently demonstrated originality in motor drive technology for mechatronic equipment and conveyor systems, image processing technology for inspection and measurement devices, and application products of laser technology, as well as integrating these standalone devices into CIM as FA systems. Our mission is to fully utilize the technological capabilities we have accumulated so far and to deliver products and devices that will delight our customers more than ever before. In the future, we aim to be a one-of-a-kind company that consistently demonstrates originality in the ever-advancing field of information and communication technology.
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