We will solve your problems with bonding and sealing! We can accommodate prototypes and demonstrations.
This product is a bonding device that proposes a new bonding process combining vacuum and atmosphere. In the bonding of flexible substrates, it resolves issues such as bubble entrapment in decorative panels with steps and slits. Additionally, flat bonding eliminates pressure unevenness and positional misalignment in thin substrates like films. 【Features】 ■ Line contact bonding (atmosphere/vacuum) Enables bonding under vacuum conditions, producing good quality products regardless of bonding conditions. ■ 3D/2.5D bonding (vacuum) Allows for bonding that conforms to curved surfaces by applying high pressure after contact in a vacuum. ■ Flat bonding (vacuum) Performs vacuum bonding with higher flatness accuracy and high-precision alignment than conventional methods. *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Three Bonding Mechanisms】 ■ Bonding of flexible substrates (line contact bonding) ■ Bonding of 3D shapes (curved surfaces) and 2.5D shapes (bent surfaces) (3D/2.5D bonding) ■ Bonding of flat shapes (planar bonding) *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
Organic EL displays, organic EL lighting, dye-sensitized solar cells, organic thin-film solar cells, electronic paper, for semiconductor development. *For more details, please refer to the PDF document or feel free to contact us.*
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We solve your problems with bonding and sealing! - We propose a new bonding process that combines vacuum and atmosphere - Bonding of various shapes is possible. Prototyping and demo support are available, so please consult with us. At Joyo Engineering, as a top manufacturer of LCD bonding equipment and LCD cell gap formation equipment, we have produced many specialized devices that cater to various materials and process conditions, responding to our customers' needs. Based on numerous achievements, we have now released a new "vacuum bonding device." This device solves issues such as "air bubble inclusion in decorative panels with steps or slits," "design constraints of 2.5D/3D shapes," and "processing unevenness and positional deviation of thin substrates like films," enabling bonding of various shapes.
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