Fundamentals of Aerosol Deposition (AD) Method, Film Formation Characteristics, and Device Applications

Introducing the latest information on the fundamentals such as film formation principles and process parameters, as well as the development of applications for energy devices.

**Lecture Summary** The new film formation technology utilizing the phenomenon of particle collision solidification, which forms a ceramic film on a substrate by dispersing and mixing ceramic microparticles in gas and then injecting them at high speed from a nozzle to collide with the substrate, has characteristics such as the ability to form thick films relatively easily at room temperature, resulting in dense structures composed of nanometer-level crystallite sizes. Due to its dense quality, the film exhibits high hardness, excellent adhesion to the substrate, and superior electrical insulation properties. This method allows for the film formation of various materials, including oxides such as alumina, titanium oxide, barium titanate, lead zirconate titanate (PZT), and yttria, as well as non-oxide materials like silicon carbide, and it also enables the composite of different materials. Additionally, since the film formation occurs at room temperature, it can be applied to low melting point materials such as resins and metals. In this presentation, I will discuss the characteristics of this film formation technology, compare it with conventional film formation methods, explore the relationships of various parameters affecting film formation, and discuss the application developments of this film material.

Technical Seminar