Ideal for fine samples such as electronic materials.
It has a thin PET base with uniform thickness. It is ideal for precision finishing without grinding marks. It is used for final wrapping of electronic materials and composite materials.
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basic information
Types of Abrasives Diamond (D), White Alumina (WA), Green Carbonite (GC) Grain Size #400 to #20000
Price information
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Delivery Time
Applications/Examples of results
Sample grinding
Company information
Since our establishment, we have accumulated technology and know-how as a precision polishing manufacturer in the semiconductor and liquid crystal industries. Leveraging that know-how, we supply precision polishing equipment not only for metal precision polishing but also for semiconductor wafer polishing, compound semiconductor polishing, semiconductor and liquid crystal panel polishing, shaft polishing, sample polishing, and other industries. Being a Japanese product, and specifically made in Wakayama Prefecture, we offer specifications that cater to specific needs. Because we handle design, electrical, materials, manufacturing, and sales all in-house, we can flexibly accommodate custom specifications. In addition, in our control division, we provide maintenance and equipment modifications for existing customer equipment, as well as PLC replacements, utilizing the technology developed through our equipment development. We are dedicated to a customer-first philosophy, striving to improve without being confined to our own designed equipment or specific fields. If you have any polishing concerns, please reach out to IMT first.
