A device that separates wafers one by one using a water jet within a chamber.
The "Wafer Separation Cleaning Device ME-5700" is a device that manually sets wafers onto a transport arm, where they are separated one by one using a water jet in the chamber, and then manually collected. The external dimensions are L1300×W1200×H2100. For more details, please contact us or refer to the catalog.
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basic information
【Specifications】 ○ Manually set the wafer onto the transport arm ○ Separate using a water jet inside the chamber ○ Peel off one by one ○ Manual collection ○ External dimensions: L1300 x W1200 x H2100 ● For more details, please contact us or refer to the catalog.
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Company information
July 2009: Received certification for a research and development plan related to the advancement of manufacturing infrastructure technology for small and medium-sized enterprises from the Ministry of Economy, Trade and Industry. June 2010: Began joint development with the National Institute of Advanced Industrial Science and Technology on glass etching for solar cells. February 2011: Ordered and received an 8-inch chemical cleaning system for the 3D semiconductor research center. July 2011: Contracted by Saitama Prefecture for the next-generation industry entry support project. November 2011: Developed an alkaline spin etching system. Specifications: For large substrates (300 mm square). February 2012: Completion of the next-generation industry entry support project in Saitama Prefecture. April 2012: Newly developed silicon wafer separator for solar cells.