Ideal for applications such as dicing saws, bonding machines, and tape mountings.
The "Porous Carbon Chuck" is a suction table that uses carbon porous material on its surface. Due to its porous nature, it can adhere to the entire surface of the workpiece, and it can also hold thin materials such as films. Additionally, it is capable of vacuum suction in environments where acid resistance and chemical resistance are required. Furthermore, because it is conductive, it can perform vacuum suction in devices that are sensitive to static electricity. It can accommodate various sizes and shapes. The workpieces include 200mm, 300mm, and 450mm wafers, glass substrates, and films. It is suitable for dicing saws, bonding machines, tape mountings, spin cleaning devices, and other semiconductor manufacturing equipment, as well as various inspection devices and printing-related equipment. For more details, please contact us or refer to the catalog.
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basic information
【Features】 ○ Can adsorb over the entire surface of the workpiece due to its porous structure ○ Can adsorb even thin materials such as films ○ Capable of vacuum adsorption in environments requiring acid resistance and chemical resistance ○ Can perform vacuum adsorption in devices that dislike static electricity due to its conductivity ○ Compatible with various sizes and shapes ○ Workpieces: 200mm/300mm/450mm wafers, glass substrates, films ● For more details, please contact us or refer to the catalog.
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Applications/Examples of results
【Applications】 ○ Dicing saws, bonding machines, tape mount machines ○ Spin cleaning devices, other semiconductor manufacturing equipment, various inspection devices, printing-related equipment ● For more details, please contact us or refer to the catalog.
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Company information
July 2009: Received certification for a research and development plan related to the advancement of manufacturing infrastructure technology for small and medium-sized enterprises from the Ministry of Economy, Trade and Industry. June 2010: Began joint development with the National Institute of Advanced Industrial Science and Technology on glass etching for solar cells. February 2011: Ordered and received an 8-inch chemical cleaning system for the 3D semiconductor research center. July 2011: Contracted by Saitama Prefecture for the next-generation industry entry support project. November 2011: Developed an alkaline spin etching system. Specifications: For large substrates (300 mm square). February 2012: Completion of the next-generation industry entry support project in Saitama Prefecture. April 2012: Newly developed silicon wafer separator for solar cells.