It is possible to stably transport workpieces with a thickness of 50 μm, and it is also compatible with FPC transport.
The copper surface roughening treatment device, micro-etching device, is a surface treatment device capable of stably transporting workpieces with a thickness of 50 μm. The fine specification nozzle pattern and oscillation mechanism enable uniform surface accuracy. The upper etching is individually pressure-controlled for even higher precision. For more details, please contact us or refer to the catalog.
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basic information
【Features】 ○ Stable transport of workpieces with a thickness of 50μm ○ Achieves uniform surface treatment with high flatness ○ Compatible with FPC transport 【Specifications Example】 ○ Equipment dimensions (L×W×H) 13625 × 4050 × 1350 mm ○ Substrate size (effective width) 500mm ○ Processing liquid Compatible with various chemical manufacturers ○ Transport speed 1–4m/min ● For more details, please contact us or refer to the catalog.
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Applications/Examples of results
【Purpose】 ○ Roughening treatment of copper surfaces ● For more details, please contact us or refer to the catalog.
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Company information
◆Development, etching, stripping devices/cleaning devices for FPC ◆Development, etching, stripping devices/cleaning devices for COF ◆Development, etching, stripping devices/cleaning devices for FPD (TFT/PDP) ◆Cleaning devices for solar cells ◎Fine technology Fine results cannot be reproduced without a comprehensive design that combines nozzle arrangement, nozzle characteristics, oscillation, pressure adjustment, etc. ◎Thin plate transport technology Experience and proven results are essential for transporting thin plates without damage. The Ninomiya system has incorporated creativity and ingenuity to achieve reliable transport. ◎High reliability Devices designed to achieve a higher level can be used with confidence by our customers. The Ninomiya system does not compromise on device manufacturing.