Case Studies of Hot Melt Molding for Waterproof Sealing of Circuit Boards and Electrical Components
Low Pressure Molding, Hot Melt Molding, Waterproof and Dustproof, Encapsulation Molding
"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.
We introduce the adoption of hot melt molding technology that demonstrates excellent sealing performance by directly injecting sustainable hot melt adhesives made from natural fatty acids into electronic components. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in the number of components 2. Reduction in the amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog. ◆ If you would like a sample of the actual product, please contact us.
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basic information
●What is Hot Melt Molding? It is a technology that demonstrates excellent sealing performance by directly injecting hot melt adhesive into electronic components. □Advantages of Adoption 1. Reduction in Processing Time Hot melt molding completes one molding cycle in about 10 seconds to several tens of seconds. Unlike potting, there is no need for curing time. 2. Reduction in the Number of Parts Unlike potting, hot melt molding does not require a case. This allows for a reduction in the number of parts and production processes. 3. Reduction in the Amount of Resin Used Hot melt molding can be shaped with minimal thickness that conforms to the inserted components. At Matsumoto Processing, we respond quickly to the reliability requirements of our customers' products by proposing optimal hot melts, modeling sealing shapes, designing and manufacturing molds, and prototyping. For customers wishing to introduce hot melt molding processes in-house, we provide comprehensive support including the manufacturing and sale of molding machines and molds, development of molding parameters, process startup assistance, and supply of hot melt adhesives. Additionally, for customers who wish to outsource hot melt sealing, we offer contract molding services.
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Applications/Examples of results
- Waterproofing of printed circuit boards for automotive/consumer use - Waterproofing of sensors for automotive/consumer use - Waterproofing of harnesses for automotive/consumer use
Detailed information
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LED module For waterproof protection of LED fixtures. Achieve cost reduction by switching from silicone potting!
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Waterproof protection for printed circuit boards. Achieve significant cost reduction by switching from epoxy potting. Additionally, it is a one-step process that takes only a few seconds, so no work-in-progress is needed!
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For small quantities, hot melt molding is low pressure, which means that the equipment and molds are also small and inexpensive (molds cost around 300,000 to 500,000 yen). If the production cost of resin cases is high for small-scale production, please consider hot melt molding.
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Intermediate harnesses for water-related equipment, etc. Achieve cost reduction through hot melt molding with case-less design, reduced resin usage, and shortened production time!
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Company information
Our company provides comprehensive support for the introduction of hot melt molding methods, from initial technical discussions and appropriate hot melt selection to prototype production and evaluation, optimal process considerations for mass production, proposals for optimal equipment or the design and manufacturing of dedicated machines (automated systems), hot melt supply and line support. For customers for whom equipment installation poses a barrier to adopting this method, we even offer production contracting at our facility, ensuring support from "start to finish." **Benefits of Hot Melt Molding** - Improved production efficiency and cost reduction through alternative methods to potting - Greater design flexibility due to mold forming, enabling miniaturization and lightweighting of components - Use of sustainable raw materials derived from natural fatty acids We have various molding machines and displays of adopted products available at our prototype lab in Fuji City, Shizuoka Prefecture. Please feel free to visit, even just for a tour.
