松本加工 Company Profile

"Free Sample Presentation Campaign" This time, we are offering free samples of our LED-equipped boards that have been completely sealed using hot melt molding to customers who request them. Please feel free to take a look at the actual product. "What is Hot Melt Molding?" It is a groundbreaking sealing method that provides excellent waterproofing, dustproofing, and insulation by injecting thermoplastic adhesive around electronic components. Since it solidifies within seconds in the mold, sealing is completed in a shorter time compared to traditional two-component potting and BMC molding. Additionally, the hot melt we handle is primarily made from natural fatty acids derived from grains, making it highly sustainable. Customers who wish to receive a sample, please do not hesitate to contact us.

The technology "Hot Melt Molding," which is expanding its adoption for waterproofing, dustproofing, and insulation protection of various electrical components, rapidly solidifies thermoplastic hot melt adhesives within molds, completing sealing in a short time of just a few dozen seconds. Compared to traditional urethane potting and epoxy potting, this technology allows for sealing to be completed in an ultra-short time, leading to alternatives aimed at process improvement and cost reduction. Additionally, because it involves mold forming, it offers high freedom of shape, receiving high praise for miniaturization and lightweighting of components. Our company, Matsumoto Processing, has been involved in the protection of many electrical components, including automotive electrical components, as a pioneer of this technology alongside our customers. We can achieve material selection, specification consideration, prototype shape design, mold manufacturing, and prototyping in a short time. Customers interested in this technology are encouraged to feel free to contact us.

In recent years, the importance of thermal management has been increasing to efficiently dissipate heat in components that are miniaturized or require high current. Therefore, Matsumoto Processing is proposing a two-component curing thermal conductive filler. This material can be automatically applied at room temperature using a dispenser, can be easily compressed to any desired thickness, and flexibly conforms to the unevenness of components. It reacts and cures within a few hours after application, and after curing, it becomes a solid material with flexibility, eliminating concerns about pump-out during long-term use. This product is expanding its applications in filling gaps between heat-generating components and heat sinks, as well as between heat-generating substrates and aluminum cases. Please feel free to contact us.