Introducing the waterproof, dustproof, and insulation protection technology for various electrical components called "hot melt molding." Sealing is completed in just a few dozen seconds, achieving process improvement and cost reduction.

Waterproofing, insulation, and dustproofing for electrical components! We are currently offering a free collection of 'case studies and technical materials' filled with tips and know-how for process improvement!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! 'Hot Melt Molding' is a groundbreaking new technology for waterproof processing of circuit boards and electronic components that significantly reduces processing time compared to traditional methods. The sealing agent is primarily made from natural fatty acids derived from grains, making it excellent for sustainability. Our case study collection includes numerous examples where switching from potting to hot melt molding has led to reduced processing time and cost savings. Technical materials provide know-how on hot melt molding and waterproof processing of circuit boards and electronic components, including comparisons and benefits over traditional methods. ■ Currently, we are offering three types of case studies and two types of technical materials as a free gift ■ [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Materials (10 pages) ■ [Technical Material] Achieving VA by Switching from Potting (7 pages, 3 cases) * Please view the 'Hot Melt Molding Case Study Collection & Technical Materials' PDF available for download.

• Other electronic parts
• Processing Contract
• Coating Agent

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

Significant reduction in processing time and number of parts! Insert molding waterproof method that directly injects thermoplastic adhesive into electronic components! In recent years, adoption in automotive parts has been expanding. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in number of parts 2. Reduction in amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog.

• Other electronic parts
• Circuit board design and manufacturing
• Coating Agent

Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention for the waterproof sealing of electrical components.

I want to use hot melt molding, but... ▼ The equipment is too expensive to adopt. ▼ Since the products are in the range of dozens per lot, we cannot consume the materials. ▼ Due to fluctuations in production quantity, we want to create a buffer through outsourcing. ▼ I want to adopt it immediately, but... I can't wait for the equipment delivery time. We respond to such customer "troubles." Our company applies hot melt molding to parts such as circuit boards entrusted to us and returns them. - We can handle almost all types of molding hot melt materials, including polyamide-based, polyester-based, polyolefin-based, and reactive polyurethane-based. - Materials are kept in standard stock for each grade, minimizing the burden on our customers. Our factory is ISO 9001 certified and also supports encapsulation molding for automotive parts. ◆ Please feel free to contact us.

• EMS
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of electronic components, utilizes thermoplastic adhesives in low-pressure insert molding to achieve environmental protection such as waterproofing and dustproofing for electronic components like mounted circuit boards. Compared to traditional two-component potting and conformal coating, sealing is completed in an extremely short time, leading to an expansion in its adoption as a sealing technology. We propose a sustainable hot melt made primarily from natural fatty acids. At the Matsumoto Processing Lab, nine hot melt molding machines are installed, and you can observe the actual process of hot melt sealing electronic components. Customers interested in visiting are encouraged to inquire.

• Other electronic parts
• plastic
• Coating Agent

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! We offer contract processing for hot melt molding sealing.

"I want to use hot melt molding, but I can't install the equipment." For such customers, our factory has installed nine hot melt molding machines, and we will perform hot melt molding on the insert work provided by the customer. We can provide a comprehensive response, including selection of sealing agents, prototyping, mold manufacturing, and contract sealing processing. Available hot melts: - Polyamide-based - Polyolefin-based - Reactive polyurethane-based ◆ If you are interested, please feel free to contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

Complete sealing of electrical components in just a few dozen seconds. Waterproof, dustproof, and insulated. We will introduce the introduction process and case studies of hot melt molding in a 5-minute video.

"Hot melt molding," which is expanding as a waterproof sealing method for electrical components to replace potting. Compared to traditional two-component potting, the following advantages are being recognized, leading to its adoption: - Extremely short curing time. Hot melt molding completes sealing in just a few seconds. - Possibility of miniaturization and lightweight design. Since hot melt molding is directly insert molded into electrical components, it eliminates the need for a case, allowing for greater design freedom and achieving miniaturization and lightweight construction. - Sustainable materials. The PA-based hot melt we handle is derived from natural plant oils and is environmentally friendly. We have compiled the process for adopting hot melt molding and examples of adopted products into a video of about five minutes. Please check the video link below.

• Other electronic parts
• Other polymer materials
• Coating Agent

【Hot Melt Molding Machine】 ▼From low-cost tabletop devices to mass production machines▼ ▼Many actual machines on display at the prototype lab (Fuji City)▼

Hot melt molding, which is expanding its adoption for waterproof applications in electrical components. The MK series from Matsumoto Processing is a molding machine developed specifically for hot melt molding. It is compact and user-friendly, and has been introduced in many customers' factories. Additionally, we can accommodate customization and dedicated design of equipment according to customer requirements. Furthermore, we also support automation, including fully automatic inline machines. ◆ We have various devices on display at our prototype lab in Fuji City, Shizuoka Prefecture. Customers wishing to visit should contact us.

• Molding Equipment
• Other polymer materials
• Coating Agent

The SLA5800 series thermal mass flow controllers/meters are widely adopted as standard equipment due to their excellent accuracy, stability, and reliability. This series features a wide range of flow measurement capabilities and is suitable for various temperature and pressure conditions, making it ideal for a broad range of applications including research in the chemical and petrochemical fields, analytical instruments, fuel cells, and life sciences. Contents ■Features and Benefits ■Standard Specifications ■Product Dimensions ■Model Codes ■Approvals, Certifications, and Services ■Service and Support, etc.

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

**Improvement of Spoofing Prevention Accuracy and Performance** With FaceMe SDK 7.8, we enhance measures against increasingly sophisticated spoofing attacks by improving authentication accuracy and processing speed, thereby increasing the safety and reliability of facial recognition. - IR + RGB Spoofing Prevention: Detection accuracy improved by up to 35%, processing speed improved by up to 15% - 3D Spoofing Prevention: Detection accuracy improved by up to 56.8% for Intel RealSense D415 **Reducing Development Burden with the New Integrated API "FaceMe Authenticator"** We have integrated multiple processes that previously required individual implementation into a single API. Integrated Functions: - Face Detection + Feature Point Extraction + Spoofing Prevention + Authentication Processing Features: - Supports Windows / Ubuntu x64 / Android - Allows use of 2D cameras, 3D depth cameras, and IR + RGB cameras through a single interface - Significantly reduces development load while maintaining high-accuracy authentication

With the expansion of our production system, we have introduced and started operating the Okuma "MULTUS B330." As a result, we have established a system that can quickly respond to more advanced and complex processing needs, ranging from large components to customized precision measuring instruments. We will leverage our strength of being able to perform integrated production from measurement to assembly, strongly supporting high-precision manufacturing. Please feel free to contact us for processing inquiries or estimate requests.

In optimizing the heat treatment process, it is impossible to separate the flow of gas from the changes in the quality of the workpiece. The CAE software "DEFORM" allows for seamless coupling of fluid analysis (CFD) and gas quenching analysis within the same software. [Key Points of This Case] - Visualization of Gas Behavior: Precisely understanding the velocity distribution and flow bias within the cooling tank. - Prediction of Quenching Quality: Analyzing the temperature and microstructural changes of each part of the helical gear over time according to the flow. - Identification of Cooling Irregularities: Quantifying the heat transfer rates for specific areas such as the tooth tip, tooth root, and inner diameter. DEFORM's unique strength in simulating "from fluid to quenching" in a continuous manner supports next-generation quality design. For more details, please refer to the related links.