Hot melt molding for waterproofing, dustproofing, and cost reduction of circuit boards.
Low Pressure Molding, Hot Melt Molding, Waterproof and Dustproof, Encapsulation Molding
"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.
"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of electronic components, utilizes thermoplastic adhesives in low-pressure insert molding to achieve environmental protection such as waterproofing and dustproofing for electronic components like mounted circuit boards. Compared to traditional two-component potting and conformal coating, sealing is completed in an extremely short time, leading to an expansion in its adoption as a sealing technology. We propose a sustainable hot melt made primarily from natural fatty acids. At the Matsumoto Processing Lab, nine hot melt molding machines are installed, and you can observe the actual process of hot melt sealing electronic components. Customers interested in visiting are encouraged to inquire.
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basic information
Forming and sealing electronic components with a one-component thermoplastic adhesive that is free of unnecessary agents. By sealing and forming with the adhesive, it firmly adheres to the substrate (such as printed circuit boards) and prevents water intrusion. The material has a proven track record of use in environments ranging from -40°C to 150°C. Matsumoto Processing is capable of forming and sealing using hot melts based on polyamide, polyolefin, polyurethane, and polyester. Matsumoto Processing will propose the optimal hot melt, perform shape modeling, analysis verification, and prototype creation based on the characteristics required by the customer's product. For customers wishing to implement the process in-house, we provide comprehensive support including the production of forming machines, molds, development of forming conditions, startup assistance, and supply of hot melts. For customers who wish to outsource hot melt forming, we offer hot melt forming contract services at Matsumoto Processing's factory.
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Applications/Examples of results
1. Protection of various sensors and control circuits for automobiles Domestic and international automobile manufacturers Domestic automotive parts manufacturers 2. Battery-related Domestic battery manufacturers 3. Other electronic devices Domestic home appliance manufacturers Domestic sensor manufacturers Domestic harness assembly manufacturers
Detailed information
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Examples of waterproof sealing for agricultural machinery substrates. The left photo shows before sealing, and the right photo shows after sealing (the black area is the hot melt molded part).
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Example of encapsulation for industrial equipment circuit boards. The left photo shows before encapsulation, and the right photo shows after encapsulation (the black part is the hot melt molded section).
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Example of waterproof sealing for motor stators: The amber-colored part covering the circuit board and the coil in the photo is hot melt molded.
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Company information
Our company provides comprehensive support for the introduction of hot melt molding methods, from initial technical discussions and appropriate hot melt selection to prototype production and evaluation, optimal process considerations for mass production, proposals for optimal equipment or the design and manufacturing of dedicated machines (automated systems), hot melt supply and line support. For customers for whom equipment installation poses a barrier to adopting this method, we even offer production contracting at our facility, ensuring support from "start to finish." **Benefits of Hot Melt Molding** - Improved production efficiency and cost reduction through alternative methods to potting - Greater design flexibility due to mold forming, enabling miniaturization and lightweighting of components - Use of sustainable raw materials derived from natural fatty acids We have various molding machines and displays of adopted products available at our prototype lab in Fuji City, Shizuoka Prefecture. Please feel free to visit, even just for a tour.
![[For Waterproofing Circuit Boards!] Technical Document: Introduction to Hot Melt Molding](https://image.mono.ipros.com/public/product/image/fb4/2000257373/IPROS14586113628702833966.jpeg?w=280&h=280)
![[Example] Preventing metal migration due to moisture in multilayer printed circuit boards.](https://image.mono.ipros.com/public/product/image/984/2000640006/IPROS21370121225881087240.jpeg?w=280&h=280)
![[Example] Using FluoroSurf as a concentrated waterproof spray.](https://image.mono.ipros.com/public/product/image/84e/2000640116/IPROS83989113576455681480.jpeg?w=280&h=280)
