A sealing method that can simultaneously achieve "tact reduction," "reduction in the number of parts," and "miniaturization"! The optimal hot melt molding for waterproof sealing of electrical components.
This is a next-generation sealing technology that imparts excellent environmental resistance, such as waterproofing and dustproofing, to various electronic components like circuit boards and sensors by low-pressure insert molding with hot melt thermoplastic adhesives. Compared to conventional methods like potting, it simultaneously achieves "shortened tact time," "reduced number of components," "miniaturization and weight reduction," and "lower defect rates," leading to its expanding adoption in various fields as a next-generation sealing technology.
【Adoption Fields】
- Automotive interior and exterior electronic components for four-wheeled and two-wheeled vehicles
- Interior and exterior electronic components for working vehicles such as agricultural and construction machinery
- Electronic components for industrial equipment, FA devices, and robots
- Electronic components for home appliances and consumer devices
- Electronic components for infrastructure equipment
- Electronic components for outdoor working machinery and power tools
- Electronic components for communication devices like 5G and LPWA
etc.
【Adoption Examples】
- Waterproof sealing of automotive interior and exterior electronic components (circuit boards, sensors, harnesses, switches, etc.)
- Waterproof and dustproof sealing of electronic components in FA equipment (circuit boards, sensors, etc.)
- Waterproof sealing of control boards for power tools
- Sealing of industrial communication and IoT devices
- Waterproof sealing of various sensors, such as gas sensors and angle sensors
etc.
The sealing technology is expanding its adoption in various fields as a replacement for potting!