[For Waterproofing Circuit Boards!] Technical Document: Introduction to Hot Melt Molding
Low Pressure Molding, Hot Melt Molding, Waterproof and Dustproof, Encapsulation Molding
Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!
Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention as a waterproof technology for circuit boards. What is hot melt molding? How is it different from potting? What is the process for implementation? We will answer these questions. In recent years, hot melt molding has been increasingly adopted in various fields such as automotive electronic components, mobile devices, home electronics, and IoT devices as a waterproofing method to replace potting, contributing to improved productivity and cost reduction.
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basic information
What is hot melt molding? Advantages of hot melt molding How to get started with hot melt molding? We will answer such questions. ■Please download the catalog from below. Matsumoto Processing will respond quickly to your needs by proposing the optimal hot melt solution, modeling sealing shapes, designing and manufacturing molds, and creating prototypes based on your product reliability requirements. For customers wishing to implement hot melt sealing processes in-house, we provide comprehensive support including the manufacturing and sales of molding machines and molds, development of molding parameters, process startup assistance, and hot melt supply. For customers who wish to outsource hot melt sealing, we offer contract molding services at our factory.
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Applications/Examples of results
- Waterproof sealing of automotive parts (electrical components) - Waterproof sealing of mobile device parts - Waterproof sealing of home electronics device parts - Waterproof sealing of IoT devices (sensors, etc.) and more In particular, there are many cases where customers who traditionally used two-component potting have adopted hot melt molding for cost reduction and process improvement. By switching to hot melt molding, it is possible to achieve cost reduction and miniaturization.
Detailed information
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Example of waterproof sealing for agricultural machinery substrates. The left photo is before sealing, and the right photo is after sealing (the black part is the hot melt molded section).
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Example of encapsulation for industrial equipment circuit boards. The left side of the photo shows before encapsulation, and the right side shows after encapsulation (the black area is the hot melt molded part).
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Example of prevention sealing for motor stators: The amber-colored part covering the circuit board and surrounding the coil in the photo is hot melt molded.
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Company information
Our company provides comprehensive support for the introduction of hot melt molding methods, from initial technical discussions and appropriate hot melt selection to prototype production and evaluation, optimal process considerations for mass production, proposals for optimal equipment or the design and manufacturing of dedicated machines (automated systems), hot melt supply and line support. For customers for whom equipment installation poses a barrier to adopting this method, we even offer production contracting at our facility, ensuring support from "start to finish." **Benefits of Hot Melt Molding** - Improved production efficiency and cost reduction through alternative methods to potting - Greater design flexibility due to mold forming, enabling miniaturization and lightweighting of components - Use of sustainable raw materials derived from natural fatty acids We have various molding machines and displays of adopted products available at our prototype lab in Fuji City, Shizuoka Prefecture. Please feel free to visit, even just for a tour.
