We will exhibit at Interop Tokyo (Autumn) from September 9 (Wednesday) to September 11 (Friday), 2026 at Makuhari Messe.

A low-pressure molding method that replaces 2-liquid potting, achieving improved production efficiency and miniaturization. Case studies will be presented at Nepcon Japan in September 2026!

Hot melt molding is a low-pressure molding method aimed at waterproofing, dustproofing, and insulation of electrical components. In traditional two-component potting methods such as urethane and epoxy, production delays due to curing time and the need for securing workspace were challenges. This method allows the resin to rapidly cure in just a few seconds to several tens of seconds, enabling the product to flow to the next process immediately after sealing, thereby improving production efficiency and reducing costs on the manufacturing line. It is used in automotive electrical components, sensors, and IoT devices, and is expected to be adopted in markets such as drones and e-bikes for waterproofing measures in the future. 【Features】 ■ Cures in just 30 seconds, completing full waterproof sealing of components ■ Improved efficiency of the entire production process by replacing two-component potting ■ High design flexibility through mold forming using thermoplastic resin * For more details, please download the materials or feel free to contact us. 【Exhibition Information: Internepcon Japan Autumn】 Venue: Makuhari Messe Dates: September 9 (Wed) - September 11 (Fri), 2026 Exhibition lineup: Hot melt adhesives for low-pressure molding, dedicated low-pressure molding equipment for hot melt, etc. ★ We sincerely look forward to your visit! ★

• Printed Circuit Board
• Other polymer materials
• Coating Agent

Waterproof and dustproof components for drone electrical equipment 【Hot melt low-pressure molding sealing】 The hot melt molding sealing method, which boasts high reliability in protecting automotive electrical components, is applied to drones.

Drones, which are being utilized in various fields starting from agriculture, forestry, and fisheries, have recently expanded their applications to logistics. One of the challenges as the areas of use broaden is reliability in harsh environments such as rain and sand. Therefore, Matsumoto Processing proposes a highly reliable electronic component protection method, developed through waterproofing and dustproofing automotive and aircraft parts, specifically for drones: the hot melt low-pressure molding technique. Main Features: ★1 High Reliability: The hot melt and molding sealing method has over 20 years of proven performance in waterproof and dustproof applications for automotive and aircraft parts, boasting high reliability. ★2 Compact and Lightweight: As it involves mold forming, there is great freedom in shape, allowing for smaller and lighter sealing compared to potting with two-component sealants. ★3 High Production Efficiency: Cooling and solidification occur within seconds in the mold, completing the sealing process quickly. ★4 Sustainable: The sealing material is an environmentally friendly material primarily made from plant-derived natural fatty acids. Matsumoto Processing can flexibly accommodate initial small-scale prototypes. Please feel free to contact us.

• Circuit board design and manufacturing

Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!

"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.

• Other electronic parts
• Processing Contract
• Coating Agent

Waterproof sealing and insulation of electrical components using hot melt molding. Case studies will be presented at Nepcon Japan (Autumn) in September 2026.

A groundbreaking sealing method for waterproofing and dustproofing electronic components【Hot Melt Molding】 rapidly solidifies in just a few seconds, allowing for quick transition to the next process. Its high degree of freedom in shape and potential for miniaturization and lightweight design have led to its increasing adoption as an alternative method to two-component potting materials like urethane and epoxy. At Internepcon Japan (Autumn), we will showcase many products that have actually adopted this method. We look forward to your visit. ↓↓Exhibition Information↓↓ Internepcon Japan Autumn Venue: Makuhari Messe Dates: September 9 (Wednesday) to September 11 (Friday), 2026 ★★We sincerely await your visit.★★

• Printed Circuit Board
• Other polymer materials
• Coating Agent

Complete sealing of electrical components in just a few dozen seconds. Waterproof, dustproof, and insulated. We will introduce the introduction process and case studies of hot melt molding in a 5-minute video.

"Hot melt molding," which is expanding as a waterproof sealing method for electrical components to replace potting. Compared to traditional two-component potting, the following advantages are being recognized, leading to its adoption: - Extremely short curing time. Hot melt molding completes sealing in just a few seconds. - Possibility of miniaturization and lightweight design. Since hot melt molding is directly insert molded into electrical components, it eliminates the need for a case, allowing for greater design freedom and achieving miniaturization and lightweight construction. - Sustainable materials. The PA-based hot melt we handle is derived from natural plant oils and is environmentally friendly. We have compiled the process for adopting hot melt molding and examples of adopted products into a video of about five minutes. Please check the video link below.

• Other electronic parts
• Other polymer materials
• Coating Agent

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

Significant reduction in processing time and number of parts! Insert molding waterproof method that directly injects thermoplastic adhesive into electronic components! In recent years, adoption in automotive parts has been expanding. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in number of parts 2. Reduction in amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog.

• Other electronic parts
• Circuit board design and manufacturing
• Coating Agent

Waterproofing, insulation, and dustproofing for electrical components! We are currently offering a free collection of 'case studies and technical materials' filled with tips and know-how for process improvement!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! 'Hot Melt Molding' is a groundbreaking new technology for waterproof processing of circuit boards and electronic components that significantly reduces processing time compared to traditional methods. The sealing agent is primarily made from natural fatty acids derived from grains, making it excellent for sustainability. Our case study collection includes numerous examples where switching from potting to hot melt molding has led to reduced processing time and cost savings. Technical materials provide know-how on hot melt molding and waterproof processing of circuit boards and electronic components, including comparisons and benefits over traditional methods. ■ Currently, we are offering three types of case studies and two types of technical materials as a free gift ■ [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Materials (10 pages) ■ [Technical Material] Achieving VA by Switching from Potting (7 pages, 3 cases) * Please view the 'Hot Melt Molding Case Study Collection & Technical Materials' PDF available for download.

• Other electronic parts
• Processing Contract
• Coating Agent

Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention as a waterproof technology for circuit boards. What is hot melt molding? How is it different from potting? What is the process for implementation? We will answer these questions. In recent years, hot melt molding has been increasingly adopted in various fields such as automotive electronic components, mobile devices, home electronics, and IoT devices as a waterproofing method to replace potting, contributing to improved productivity and cost reduction.

• Other electronic parts
• plastic
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

Numerous examples of achieving value analysis (VA) by replacing the two-component potting process with hot melt molding are published! This is a technical case study document summarizing these examples from a process perspective. ■ Currently, we are offering technical documents and various case studies for free! ■ 【Published Information】 ■ Differences between potting and hot melt molding ■ Process flow implementation - Potting process ■ Process flow implementation - Hot melt molding ■ Application 1: Waterproof sealing of LED fixtures ■ Application 2: Waterproof sealing of micro switches ■ Application 3: Waterproof sealing of temperature sensors

• Other electronic parts
• Other polymer materials
• Coating Agent

Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention for the waterproof sealing of electrical components.

I want to use hot melt molding, but... ▼ The equipment is too expensive to adopt. ▼ Since the products are in the range of dozens per lot, we cannot consume the materials. ▼ Due to fluctuations in production quantity, we want to create a buffer through outsourcing. ▼ I want to adopt it immediately, but... I can't wait for the equipment delivery time. We respond to such customer "troubles." Our company applies hot melt molding to parts such as circuit boards entrusted to us and returns them. - We can handle almost all types of molding hot melt materials, including polyamide-based, polyester-based, polyolefin-based, and reactive polyurethane-based. - Materials are kept in standard stock for each grade, minimizing the burden on our customers. Our factory is ISO 9001 certified and also supports encapsulation molding for automotive parts. ◆ Please feel free to contact us.

• EMS
• Coating Agent

CLT, which has been utilized in the field of architecture, is now expanding its possibilities into civil engineering sites. The "Hyper CLT Mats" are wooden lightweight mats that utilize CLT. They can be used as wooden mats for temporary roads, access routes, heavy machinery work yards, and material storage areas, providing an alternative to traditional steel plates on site. The 5×10 version weighs approximately 230 kg, making it relatively lightweight and easy to install, remove, and relocate. Additionally, it offers environmental benefits such as reducing glare and metallic sounds, as well as CO2 fixation, thanks to its wooden composition. Moreover, the Hyper CLT Mats are registered under the Ministry of Land, Infrastructure, Transport and Tourism's NETIS technology "TH-250021-A," making them eligible for proposals in the use of new technologies in public works. Transforming CLT from "building material" to "civil engineering material," it is expanding the new possibilities of civil engineering CLT in the form of wooden lightweight mats.

The power system is transitioning from DC12V / DC24V systems to DC48V systems. Therefore, we have launched the "48V Special Feature" page! On this special feature page, we will provide information useful for customers considering DC48V systems, including an introduction to products compatible with DC48V, the advantages and disadvantages of transitioning to a DC48V system, and related information that can assist in system construction. If you have any of the following concerns: "I am looking for products compatible with DC48V" "I am considering transitioning from DC12V / DC24V" "I want to know more about DC48V systems" Please take a look at the "48V Special Feature"! If you have any questions regarding product selection or specifications, please feel free to contact us through our website.

We handle TFT LCD modules from WINSTAR for use in display sections of devices. 【We receive inquiries in the following situations】 - Wanting to update the display section of measuring instruments or control panels - Looking for LCDs to incorporate into industrial equipment - Searching for a supplier that can accommodate small quantities 【We can assist with】 - Selecting sizes and interfaces that meet application and enclosure conditions - Confirming pin assignments and arranging samples - Developing custom products and embedded systems - Selling in small lots We also handle OLED (organic EL) modules from the same WINSTAR company. Please consider these as well for devices that want to take advantage of their thinness, low power consumption, and wide viewing angles. Please check the specific specifications in the manufacturer's datasheet. We also accept requests for quotes only.

CLT is known as a building material, but its applications are not limited to just buildings. The wooden lightweight mat "Hyper CLT Mat" is a new option for utilizing CLT in civil engineering. It can be used as a wooden mat in places where steel plates have been the norm, such as temporary roads, access routes, heavy machinery work yards, and material storage areas. The 5×10 mat is relatively light at about 230 kg, making it easy to install, remove, and relocate. Additionally, it offers different values compared to steel, such as reducing glare and metallic noise, as well as CO2 fixation through wood. Moreover, the Hyper CLT Mat is registered with the Ministry of Land, Infrastructure, Transport and Tourism as a NETIS technology "TH-250021-A." It can also be utilized for proposals involving the use of new technologies and environmental considerations in public works. From construction to civil engineering, the new use of wood is expanding in the form of wooden lightweight mats.

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding methods for repairs can cause changes in the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.