We will exhibit at Interop Tokyo (Autumn) from September 9 (Wednesday) to September 11 (Friday), 2026 at Makuhari Messe.
"Hot melt molding," which solidifies in just a few dozen seconds and is attracting attention as a waterproof sealing method for electrical components. Our company will be exhibiting at Internepcon Japan (Autumn) from September 9 (Wednesday) to September 11 (Friday). On that day, we will showcase actual electrical components that have adopted hot melt molding both domestically and internationally. We look forward to your visit. We sincerely await your attendance.

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