Hot melt molding seals electrical components waterproof in just 30 seconds.
#HotMeltMolding #HotMeltForming #LowPressureMolding #LowPressureMolding #LPM
A low-pressure molding method that replaces 2-liquid potting, achieving improved production efficiency and miniaturization. Case studies will be presented at Nepcon Japan in September 2026!
Hot melt molding is a low-pressure molding method aimed at waterproofing, dustproofing, and insulation of electrical components. In traditional two-component potting methods such as urethane and epoxy, production delays due to curing time and the need for securing workspace were challenges. This method allows the resin to rapidly cure in just a few seconds to several tens of seconds, enabling the product to flow to the next process immediately after sealing, thereby improving production efficiency and reducing costs on the manufacturing line. It is used in automotive electrical components, sensors, and IoT devices, and is expected to be adopted in markets such as drones and e-bikes for waterproofing measures in the future. 【Features】 ■ Cures in just 30 seconds, completing full waterproof sealing of components ■ Improved efficiency of the entire production process by replacing two-component potting ■ High design flexibility through mold forming using thermoplastic resin * For more details, please download the materials or feel free to contact us. 【Exhibition Information: Internepcon Japan Autumn】 Venue: Makuhari Messe Dates: September 9 (Wed) - September 11 (Fri), 2026 Exhibition lineup: Hot melt adhesives for low-pressure molding, dedicated low-pressure molding equipment for hot melt, etc. ★ We sincerely look forward to your visit! ★
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basic information
For more details, please download the materials or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
Automotive electrical components Two-wheeled vehicle electrical components Sensors, etc. IoT devices HEMS Security equipment
Detailed information
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Complete sealing of the motor stator for waterproofing and dustproofing purposes.
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Complete sealing of the printed circuit board for waterproofing and dustproofing purposes.
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Sealing of seat belt reminders for waterproof and dustproof purposes.
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Sealing of the seat sensor for waterproof and dustproof purposes.
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Company information
Our company provides comprehensive support for the introduction of hot melt molding methods, from initial technical discussions and appropriate hot melt selection to prototype production and evaluation, optimal process considerations for mass production, proposals for optimal equipment or the design and manufacturing of dedicated machines (automated systems), hot melt supply and line support. For customers for whom equipment installation poses a barrier to adopting this method, we even offer production contracting at our facility, ensuring support from "start to finish." **Benefits of Hot Melt Molding** - Improved production efficiency and cost reduction through alternative methods to potting - Greater design flexibility due to mold forming, enabling miniaturization and lightweighting of components - Use of sustainable raw materials derived from natural fatty acids We have various molding machines and displays of adopted products available at our prototype lab in Fuji City, Shizuoka Prefecture. Please feel free to visit, even just for a tour.
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