Epoxy Resin - Epoxy Molding - Stator Sealing
This is an introduction to "epoxy resin."
If you have any questions, please feel free to contact us.
- Company：浪華合成
- Price：Other
Sealing - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS
Sealing Product List
1～7 item / All 7 items
Displayed results
Visualization solution for the interior of molds in semiconductor resin encapsulation.
We propose improvements to the quality and production efficiency of package molding, where issues become apparent!
There is a trend in the automotive semiconductor industry, particularly in power semiconductors, to quantify the internal conditions of molds, which can be considered a black box, during the resin encapsulation process. This trend is driven by the emergence of issues related to moldability due to the miniaturization and thinning of semiconductor packages and the fine pitch. As a countermeasure, there is a growing need to improve productivity and quality through actual measurements of resin filling pressure and temperature within the mold cavity during package molding. In response to this need, Kistler proposes a "visualization solution for the interior of the mold" using high-performance quartz piezoelectric in-mold pressure sensors to measure resin filling pressure and temperature.
- Company：Kistler Japan G.K. Head office
- Price：Other
Thermosetting resin transfer molding - coil sealing
This is an introduction to "thermosetting resin (plastic) transfer molding."
If you have any questions, please feel free to contact us.
- Company：浪華合成
- Price：Other
Waterproofing for drone electrical components! 【Hot melt low-pressure molding sealing】
Waterproof and dustproof components for drone electrical equipment 【Hot melt low-pressure molding sealing】 The hot melt molding sealing method, which boasts high reliability in protecting automotive electrical components, is applied to drones.
Drones, which are being utilized in various fields starting from agriculture, forestry, and fisheries, have recently expanded their applications to logistics. One of the challenges as the areas of use broaden is reliability in harsh environments such as rain and sand. Therefore, Matsumoto Processing proposes a highly reliable electronic component protection method, developed through waterproofing and dustproofing automotive and aircraft parts, specifically for drones: the hot melt low-pressure molding technique. Main Features: ★1 High Reliability: The hot melt and molding sealing method has over 20 years of proven performance in waterproof and dustproof applications for automotive and aircraft parts, boasting high reliability. ★2 Compact and Lightweight: As it involves mold forming, there is great freedom in shape, allowing for smaller and lighter sealing compared to potting with two-component sealants. ★3 High Production Efficiency: Cooling and solidification occur within seconds in the mold, completing the sealing process quickly. ★4 Sustainable: The sealing material is an environmentally friendly material primarily made from plant-derived natural fatty acids. Matsumoto Processing can flexibly accommodate initial small-scale prototypes. Please feel free to contact us.
- Company：Matsumoto kakou Co.,Ltd.
- Price：Other
Sealed in just 30 seconds! Integrated protection for physical AI electronic modules!
Waterproofing and miniaturization of physical AI electronic components! High reliability hot melt molding sealing for protecting automotive electronic components!
In recent years, physical AI has been gaining attention. Its widespread adoption requires high reliability to operate stably even in harsh environments. In particular, waterproof and dustproof measures for electrical components mounted on the equipment are one of the important challenges. Matsumoto Processing proposes waterproof and dustproof protection for electrical components using hot melt molding technology, contributing to the safety and durability of physical AI. 【Points of Hot Melt Molding】 1. High Reliability Hot melt molding sealing has a track record of over 20 years in waterproof and dustproof applications for automotive and aircraft components, boasting high reliability. 2. Extremely Low Molding Pressure Molding is done at an extremely low pressure of 0.3 to 5 MPa, ensuring no damage is inflicted on the sealed electrical components. 3. Extremely High Productivity Sealing is completed in one shot to several tens of seconds, allowing for significant "tact time reduction" compared to potting. 4. Miniaturization and Lightweighting of Products Since molding can be done in irregular shapes that conform to the components without the need for housing, "miniaturization and lightweighting" are possible. 5. Environmentally Friendly The hot melt products we handle are primarily made from plant fatty acids derived from grains.
- Company：Matsumoto kakou Co.,Ltd.
- Price：Other
Epoxy Resin - Epoxy Molding Coil Encapsulation
This is an introduction to "epoxy resin."
Epoxy resin is excellent in heat resistance, water resistance, chemical resistance, and electrical insulation. It allows for free coloring, has low shrinkage during curing, and possesses high strength. It is used as a sealing material and can also be used as paint or adhesive in addition to electrical and mechanical components. Since it does not produce volatile substances during curing, the dimensional accuracy of the molded products is stable, and its electrical performance is also outstanding. Additionally, as a molding material with good fluidity, it can be molded at relatively low pressure. This makes it suitable for complex shapes and insert molding.
- Company：浪華合成
- Price：Other
Hot melt molding seals electrical components waterproof in just 30 seconds.
A low-pressure molding method that replaces 2-liquid potting, achieving improved production efficiency and miniaturization. Case studies will be presented at Nepcon Japan in September 2026!
Hot melt molding is a low-pressure molding method aimed at waterproofing, dustproofing, and insulation of electrical components. In traditional two-component potting methods such as urethane and epoxy, production delays due to curing time and the need for securing workspace were challenges. This method allows the resin to rapidly cure in just a few seconds to several tens of seconds, enabling the product to flow to the next process immediately after sealing, thereby improving production efficiency and reducing costs on the manufacturing line. It is used in automotive electrical components, sensors, and IoT devices, and is expected to be adopted in markets such as drones and e-bikes for waterproofing measures in the future. 【Features】 ■ Cures in just 30 seconds, completing full waterproof sealing of components ■ Improved efficiency of the entire production process by replacing two-component potting ■ High design flexibility through mold forming using thermoplastic resin * For more details, please download the materials or feel free to contact us. 【Exhibition Information: Internepcon Japan Autumn】 Venue: Makuhari Messe Dates: September 9 (Wed) - September 11 (Fri), 2026 Exhibition lineup: Hot melt adhesives for low-pressure molding, dedicated low-pressure molding equipment for hot melt, etc. ★ We sincerely look forward to your visit! ★
- Company：Matsumoto kakou Co.,Ltd.
- Price：Other
