Sustainable electrical component sealing technology "Hot Melt Molding." Suitable for waterproofing and insulation of electrical components. Achieves complete sealing in a short time.

Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention as a waterproof technology for circuit boards. What is hot melt molding? How is it different from potting? What is the process for implementation? We will answer these questions. In recent years, hot melt molding has been increasingly adopted in various fields such as automotive electronic components, mobile devices, home electronics, and IoT devices as a waterproofing method to replace potting, contributing to improved productivity and cost reduction.

• Other electronic parts
• plastic
• Coating Agent

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

We introduce the adoption of hot melt molding technology that demonstrates excellent sealing performance by directly injecting sustainable hot melt adhesives made from natural fatty acids into electronic components. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in the number of components 2. Reduction in the amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog. ◆ If you would like a sample of the actual product, please contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention for the waterproof sealing of electrical components.

I want to use hot melt molding, but... ▼ The equipment is too expensive to adopt. ▼ Since the products are in the range of dozens per lot, we cannot consume the materials. ▼ Due to fluctuations in production quantity, we want to create a buffer through outsourcing. ▼ I want to adopt it immediately, but... I can't wait for the equipment delivery time. We respond to such customer "troubles." Our company applies hot melt molding to parts such as circuit boards entrusted to us and returns them. - We can handle almost all types of molding hot melt materials, including polyamide-based, polyester-based, polyolefin-based, and reactive polyurethane-based. - Materials are kept in standard stock for each grade, minimizing the burden on our customers. Our factory is ISO 9001 certified and also supports encapsulation molding for automotive parts. ◆ Please feel free to contact us.

• EMS
• Coating Agent

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

Significant reduction in processing time and number of parts! Insert molding waterproof method that directly injects thermoplastic adhesive into electronic components! In recent years, adoption in automotive parts has been expanding. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in number of parts 2. Reduction in amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog.

• Other electronic parts
• Circuit board design and manufacturing
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for sealing electrical components against water.

The "MK600" is a compact low-pressure molding machine dedicated to hot melt, with a footprint of 900×1,200 mm. By eliminating heat hoses, which can cause material degradation and pressure loss, it establishes excellent productivity. It is covered on three sides (back and sides), and an area sensor is installed on the operator's side. By completing parts procurement and assembly within China, we have achieved an astonishing price for a dual gear pump type discharge mechanism. 【Features】 ■ Excellent safety ■ Hose-free ■ Low cost ■ Compact size ■ Uses reliable OMRON products for PLC/HMI *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Molding Equipment
• Coating Agent

Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention for the waterproof sealing of electrical components.

The "MK700H" is a dedicated low-pressure molding machine for hot melt, with the maximum mold dimensions expanded to 300×200×150 (mm) and an enhanced clamping force of 75kN. This allows for the molding of larger insert works and molds with a high number of cavities, which were difficult to mold with the "MK600" and "MK520." By completing parts procurement and assembly within China, it achieves an astonishingly low price despite using a dual gear pump type for the discharge mechanism. By separating the workstation and melter, it also allows for customization, such as adding an injection nozzle. 【Features】 ■ Supports large area products ■ Low cost ■ Uses reliable OMRON products for PLC/HMI ■ High layout flexibility *For more details, please refer to the PDF materials or feel free to contact us.

• Other electronic parts
• Molding Equipment
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

The MK520 is a low-pressure molding machine specifically designed for hot melt applications. By adopting a shuttle stage, it allows for molding to be performed in parallel with work set and work retrieval operations, achieving high productivity. Additionally, the injection system does not use heat hoses, which can cause material degradation and pressure loss, enabling precise injection control. 【Features】 ■ Excellent production capacity ■ Hose-free heating ■ Low cost ■ Parts procurement and assembly completed within China ■ Uses reliable OMRON products for PLC/HMI *For more details, please refer to the PDF materials or feel free to contact us.

• Other electronic parts
• Molding Equipment
• Coating Agent

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

A waterproof insert molding method that directly injects thermoplastic adhesives into electronic components! We have received many inquiries and requests in the past for applications such as LED lighting fixtures, decorative lighting, and optical sensors, but conventional materials had a strong yellow tint and issues with light transmittance. This time, we are introducing a material that not only supports low-pressure molding sealing of electronic components like traditional hot melts but also excels in light transmittance. <Expected products for use> - LED lighting equipment - Display devices using LEDs, etc. - Light-based sensors such as photo sensors and fiber sensors

• Other electronic parts
• Other polymer materials
• Coating Agent

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed