Compact space-saving tabletop ACF bonding device.
- By specializing in compact circuit boards, it is smaller and lighter compared to conventional devices. - Setup and switching are easy, allowing for support of a wide variety of types and models. - By using the optional adjustable circuit board fixture, easy crimping operations can be immediately performed on circuit boards measuring 90mm x 110mm or smaller.
Inquire About This Product
basic information
The ACF bonding device is a tabletop device used for the bonding of anisotropic conductive film (ACF) between FPC and circuit boards in mobile device substrates such as mobile phones, smartphones, e-books, game consoles, handheld terminals, and other small printed circuit boards.
Price range
P5
Delivery Time
Applications/Examples of results
It is possible to bond anisotropic conductive film (ACF) between FPC and the board using small printed circuit boards represented by smartphones and mobile devices.
catalog（1）
Download All Catalogs
Company information
Omiya Industrial Co., Ltd. manufactures and sells precision measuring instruments, semiconductor and liquid crystal manufacturing-related equipment, and provides maintenance for rotating machinery. Please feel free to contact us if you have any inquiries.
![[Comprehensive Catalog] Information on Cutting Machines and Cable Processing Machines](https://image.mono.ipros.com/public/product/image/83b/2000521084/IPROS15236009313181914710.png?w=280&h=280)
![[Case Studies] Coolant Tank Unit - 7 Examples of Production](https://image.mono.ipros.com/public/product/image/f71/2001010763/IPROS55724470191351728853.jpeg?w=280&h=280)