Compact space-saving tabletop ACF bonding device.
- By specializing in compact circuit boards, it is smaller and lighter compared to conventional devices. - Setup and switching are easy, allowing for support of a wide variety of types and models. - By using the optional adjustable circuit board fixture, easy crimping operations can be immediately performed on circuit boards measuring 90mm x 110mm or smaller.
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basic information
The ACF bonding device is a tabletop device used for the bonding of anisotropic conductive film (ACF) between FPC and circuit boards in mobile device substrates such as mobile phones, smartphones, e-books, game consoles, handheld terminals, and other small printed circuit boards.
Price range
P5
Delivery Time
Applications/Examples of results
It is possible to bond anisotropic conductive film (ACF) between FPC and the board using small printed circuit boards represented by smartphones and mobile devices.
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Company information
Omiya Industrial Co., Ltd. manufactures and sells precision measuring instruments, semiconductor and liquid crystal manufacturing-related equipment, and provides maintenance for rotating machinery. Please feel free to contact us if you have any inquiries.