Customizable to fit your usage needs! Compact, space-saving tabletop ACF bonding device.
The "ACF Bonding Device" is a tabletop device used for thermal bonding of anisotropic conductive films (ACF) for connecting FPC/PCBs in automotive, industrial, and consumer equipment. It specializes in the small-lot production of various small components, making it suitable for development, research, and repair applications. By focusing on small PCBs, it is smaller and lighter compared to general devices. Additionally, by using an optional multi-fixing jig, experimental bonding operations can be immediately executed for PCBs measuring 144mm x 77mm or smaller. 【Features】 - Smaller and lighter compared to general devices by specializing in small PCBs - Capable of accommodating ACF bonding lengths from 14mm to 64mm - The temporary bonding device is equipped with ACF half-cut and automatic feeding mechanisms - Customization options are available to match the workpieces used - Easy setup and switching, making it suitable for small-lot production, development, research, and repair applications *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Common Specifications (Partial)】 ■ Target board dimensions: 144×74(mm) ■ ACF width: 1.0–3.0(mm) ■ ACF bonding length: 14–64(mm) ■ Number of ACF bonding and pressing: 1 piece ■ Verified ACF manufacturers: Dexerials *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
[Usage] ■Small lot production of various types, for development and research, repair *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Omiya Industrial Co., Ltd. manufactures and sells precision measuring instruments, semiconductor and liquid crystal manufacturing-related equipment, and provides maintenance for rotating machinery. Please feel free to contact us if you have any inquiries.
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