For camera modules! Fully automatic ACF bonding device suitable for FPC connections.
The "CMS-1500" is a fully automatic FOB device that performs ACF attachment, alignment, and final pressing in a single process. The alignment through image processing improves the accuracy of ACF attachment positions. Additionally, our unique carrier transport method realizes stress-free handling of the workpieces. Furthermore, this product adopts a detachable crimping tool, making model switching easy. 【Features】 ■ Suitable for FPC bonding on camera modules ■ Achieves high productivity ■ Guarantees high stable quality ■ Easy model switching *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications Overview】 ■ Camera module size: Min. 5(W)x5(D)x3(H)～Max. 13(W)x13(D)x10(H)mm ■ FPC size: Min. 10(W)x10(D)x0.05(t)～Max. 50(W)x50(D)x1(t)mm ■ Accuracy ・ ACF X,Y: ±100μm ・ Mounting X,Y: ±15μm ・ Main bonding X,Y: ±5μm ■ Heating method: Pulse heat ■ Equipment dimensions ・ Main body: 2650(W)x1700(D)x1980(H)mm ※Including FPC supply unit ・ Loader: 700(W)x1700(D)x1950(H)mm ・ Unloader: 850(W)x1700(D)×1950(H)mm ※ For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Since our founding, we have been comprehensively developing the design, manufacturing, and sales of microelectronics assembly equipment using precision sheet metal processing and ACF bonding technology. Since we began to commercialize the know-how cultivated in sheet metal processing as a tool for improving quality and productivity, we have consistently pursued business diversification and management independence through differentiated technologies. In the field of sheet metal processing, we are capable of vertical integration from product design and development to the assembly of finished products, not just contract processing, providing OEM and ODM (Original Design Manufacturing) products to our client companies. In the area of ACF bonding assembly machines, supported by the rapid development of the FPD industry, our products are adopted by many customers both domestically and internationally. In 1999, our tabletop COG assembly machine, which overturned industry norms, received the annual excellence award from the Nikkei newspaper. We take pride in the fact that the emergence of this tabletop machine has broadened the industry from being the domain of a few large companies to include many small and medium-sized enterprises. We have successfully developed the world's first "full-auto FOB line," and along with our manual tabletop machines and standalone semi-auto machines, we have evolved into a full-line manufacturer of ACF bonding assembly machines.
