We have achieved a reduced footprint with small-diameter wafer compatibility.
The SAL2241 series aligner, compatible with 50mm to 100mm wafers, is designed for transporting wafers that require positioning within semiconductor manufacturing equipment and inspection devices. It achieves a compact footprint while accommodating small-diameter wafers. It centers small-diameter wafers and positions orifices and notches with high speed and precision. A 0.1μm filter is equipped on the spindle side. The control method is via RS232C and parallel photo I/O. For more details, please contact us or refer to the catalog.
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【Features】 ○ Supports transportation requiring wafer positioning in semiconductor manufacturing equipment and inspection devices. ○ Achieves a compact footprint for small-diameter wafers. ○ High-speed, high-precision positioning for centering and locating the orientation flat and notch of small-diameter wafers. ○ Cleanliness measures: Equipped with a 0.1μm filter on the spindle side. ○ Control method: RS232C and parallel photo I/O. 【Specifications】 ○ Transported items: 2-inch, 3-inch, 100mm silicon wafers. ○ Positioning time: Centering: 6 seconds. ○ Positioning accuracy: Centering: within ±0.3mm; Orientation flat location: within ±0.3 degrees. ○ Sensor: Limited reflection type fiber sensor. ○ Size switching: Switching via command control or communication. ○ Cleanliness: ISO Class 2 (during exhaust of the drive section). ○ Drive method: 2-axis using 2-phase stepping motors. → Motor driver and controller built-in. ○ Utilities: Power supply: DC24V 3A; Positive pressure: 0.15–0.5MPa; Vacuum: -70kPa or more. ● For more details, please contact us or refer to the catalog.
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