Alignment possible with minimized wafer damage using the Bernoulli method.
The SAL30C1 series optical aligner compatible with 300mm is designed for transporting wafers that require positioning within semiconductor manufacturing equipment and inspection devices. It achieves high-speed and high-precision centering and notching of silicon wafers, enabling alignment of thin wafers. It supports thin, warped, and film-coated wafers, but please inquire about work detection capabilities and positioning accuracy. Alignment is possible while minimizing wafer damage through the Bernoulli method. The control methods are RS232C and parallel photo I/O. For more details, please contact us or refer to the catalog.
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**Features** - High-speed and high-precision positioning of silicon wafer centering and notching - Achieves alignment of thin wafers - Compatible with thin materials, warping, and film attachment → Please inquire about work detection capability and positioning accuracy - Alignment that minimizes wafer damage using the Bernoulli method - Control method: RS232C and parallel photo I/O **Specifications** - Transported items: 300mm silicon wafers, thin 300mm wafers - Positioning time: Centering: 4 seconds - Positioning accuracy: Centering: within ±0.1mm (for 300mm silicon wafers) Notch locate: ±0.1 degrees (for 300mm silicon wafers) - Sensor: Visible semiconductor laser sensor - Cleanliness: 0.1μm Class 1 (during exhaust of drive parts) - Drive method: 2-phase stepping motors used in 3 axes, with motor driver and controller built-in - Utility: Power supply: DC24V 2A → Usage flow rate: 60-120NL/min (clean air) Positive pressure: below 0.5MPa ● For more details, please contact us or refer to the catalog.
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