Alignment of 2-inch, 3-inch, and 100-150mm wafers is possible.
The optical aligner SAL3261GR series is designed to support the positioning of wafers in semiconductor manufacturing equipment and inspection devices. It is capable of aligning 2-inch, 3-inch, and 100-150mm wafers. Equipped with sensors that detect the wafer edge, it can align silicon, transparent, translucent glass, gallium arsenide, sapphire wafers, and more. For more details, please contact us or refer to the catalog.
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**Features** - Alignment of 2-inch, 3-inch, and 100-150mm wafers is possible. - Equipped with a sensor type that detects the wafer edge. → Alignment of silicon, transparent, translucent glass, sapphire wafers, etc. is possible. - An optional Z-axis unit is available for wafer re-gripping operations. - The wafer contact part of the spindle uses PEEK material and O-rings (special fluororubber). - Customization is available to match wafer shapes. **Specifications** - Transported items: 2-inch, 3-inch, and 100-150mm wafers. First orientation notch specification, untreated products. - Positioning accuracy: Centering: within ±0.2mm, Orientation locate: within ±0.2 degrees. - Positioning time: Notch search within 3 seconds (without re-gripping operation). - Sensor: Visible semiconductor laser sensor. - Cleanliness: ISO Class 2 (ISO 14644). - Drive method: 2-phase stepping motor using 3 axes, with built-in motor driver. - Utility: Power supply: DC24V 3A, Vacuum: -53kPa or more. ● For more details, please contact us or refer to the catalog.
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