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  6. Electronic materials for heat dissipation design - high thermal conductivity materials [*Contributes to the heat dissipation design of substrates!*]

Electronic materials for heat dissipation design - high thermal conductivity materials [*Contributes to the heat dissipation design of substrates!*]

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last updated:Mar 06, 2020

利昌工業
利昌工業
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High thermal conductivity materials that support the heat dissipation design of substrates equipped with high-brightness LEDs and power semiconductors.

Electronic materials for heat dissipation design include high thermal conductivity materials that feature a high thermal conductivity insulating layer on the surface of aluminum or copper plates, as well as products such as copper foil laminated materials and white printed circuit board materials that excel in UV discoloration resistance and heat discoloration resistance. We support the heat dissipation design of substrates equipped with high-brightness LEDs and power semiconductors. *For more details, please download the catalog or contact us directly.

    Other polymer materials
利昌工業画像.jpg

Electronic materials for heat dissipation design - high thermal conductivity materials [*Contributes to the heat dissipation design of substrates!*]

利昌工業画像.jpg
利昌工業画像.jpg
  • Related Link - http://www.risho.co.jp/product/products1/LED_mater…
  • Special site - Product/service details - https://pr.mono.ipros.com/risho/product/

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【Product Lineup】 ■ Metal base printed circuit board materials ■ High thermal conductivity white printed circuit board materials ■ High thermal conductivity printed circuit board materials ■ High thermal conductivity adhesive sheets ■ High thermal conductivity prepreg ■ Resin-coated copper foil *For details, please download the catalog or contact us directly.

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Risho high thermal conductivity electronics materials

Risho high thermal conductivity electronics materials

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Printed circuit board material CS-3945 that combines whiteness and high thermal conductivity.

Printed circuit board material CS-3945 that combines whiteness and high thermal conductivity.

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High thermal conductivity printed circuit board materials

High thermal conductivity printed circuit board materials

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利昌工業

利昌工業

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The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.

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