MID process chemicals with reliable selectivity (copper, nickel, tin, silver, gold finishes available)
Japan McDermid proposes a new MID plating process that offers high yield and reliable selectivity, making it ideal for plating LDS, Pd-containing resins, and double-shot MID. This process provides stable selectivity across a wide range of materials and catalysts, enabling more complex and efficient designs for the most needed low-cost molded composites. Additionally, the simple and manageable process results in stable plating rates and a long, predictable bath life.
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basic information
MID SelectPrep 2000 Ultrasonic Combined Weak Alkaline Cleaner MID Copper 100 XB Strike & Build 2 Bath Configuration Electroless Copper Plating MID Copper 100 B1 Strike & Build 1 Bath Configuration Electroless Copper Plating MID Ni Initiator 100 Pd Activator for Electroless Ni MID Copper 100 B1 Strike & Build 1 Bath Configuration Electroless Copper Plating MID LT Initiator 100 Pd Activator MID LP Nickel 100 Low Phosphorus Electroless Nickel Plating MID MP Nickel 100 Medium Phosphorus Electroless Nickel Plating MID MP Nickel 200 Medium Phosphorus Electroless Nickel Plating MID HP Nickel 100 High Phosphorus Electroless Nickel Plating MID LT Nickel 100 Low Temperature Bath Compatible Medium Phosphorus Electroless Nickel Plating MID Gold 100 Replacement Gold Plating MID Silver 100 Replacement Silver Plating MID Silver Anti-Tarnish Anti-Tarnish Agent
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※Please feel free to contact us as it depends on the process.
Applications/Examples of results
MID refers to three-dimensional molded circuit components, and it is a technology that allows for significant miniaturization of finished products by adding circuits and other elements to molded resin. The MID process chemicals from Japan's MacDermid excel in selective plating deposition on parts molded using the LDS (Laser Direct Structuring) method, achieving high yields with many plastic molding resins, and are characterized by high bath stability and long bath life. Additionally, it can accommodate high specifications such as fine pitch plating and wire bonding, and a "low-temperature electroless nickel process" has been developed specifically for molded resins that are sensitive to high temperatures.
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Company information
Founded in 1922, the vision of McDermid Company is to remain a leading global company in the plating products industry. It is expanding into the electronics, metal finishing, and printing markets. McDermid Performance Solutions is headquartered in Waterbury, Connecticut, USA, and operates in over 20 countries worldwide. Its main manufacturing facilities are located in the United States, Italy, China, and Taiwan, while its research laboratories are in the United States, the United Kingdom, and Japan.
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