Wafer cleaning equipment. Ideal for customers requiring high-spec cleanliness.
This device is optimal for customers who require high specifications of cleanliness. It is an automated device that processes each step automatically according to the set recipe parameters for five Max 8-inch wafers simultaneously. It is a dip coater-type cleaning device that reflects the dip coating technology owned by SDI. For more details, please contact us.
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basic information
【Features】 ○ An ideal device for customers requiring high-spec cleanliness. ○ An automation device that processes each step automatically according to the set recipe parameters for up to five Max 8-inch wafers. ○ A dip coater-type cleaning device that reflects the dip coating technology owned by SDI. 【Specifications】 ○ Stroke: 350mm ○ Target size: 8 inches ○ Target materials: Wafers, glass ○ Dip speed: From 0.1mm/sec to 40mm/sec ○ Coating liquid circulation: Yes ○ Coating liquid temperature control: No ○ Filter mesh: No (optional) ○ Drying section: Yes ○ Drying temperature: No (optional) ○ HEPA unit: Yes ○ Device size (approx.): W: 1850×D: 900×H: 1880mm ● For more details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Usage】 ○Process 5 Max 8-inch wafers simultaneously or 1 wafer at a time. ●For more details, please contact us.
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