[Free Sample Test Available] High seal strength even during biting! Significantly improves filling and packaging issues with ultrasound! Instant welding with power activation.
The "rinco ultrasonic pouch sealer" is a sealing device specialized for filling and packaging food and chemical products. It overcomes the disadvantages of thermal welding using ultrasonic technology. It ensures high sealing strength even when the contents are compressed, significantly improving yield due to sealing defects. Since it does not require a heater, power consumption is also reduced. 【Features】 ■ Ready for welding as soon as the power is turned on ■ Wide welding area and beautiful seal appearance (Available with three types of heads: 95mm, 163mm, and 270mm) ■ Easy operation settings, with adjustable sealing strength ■ Domestic patent application for ultrasonic sealing technology is in progress *For more details, please refer to the catalog. Feel free to contact us with any inquiries.
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basic information
The Rinco ultrasonic pouch sealer for automatic filling and packaging machines can instantly weld using friction energy from ultrasonic waves, rather than traditional heat sealers. <Other Features> - A new one-head solution replacing the heat and cooling processes - Ensures sealing strength even when sealing liquids (oils, etc.) and solids (food) - High-rigidity equipment design with IP67 compliant actuators - A variety of sealing shapes - Simultaneous welding possible with one head (1 or 2 packaging materials) and two heads (2 or 4 packaging materials) - Data management and error detection functions with a high-performance ultrasonic generator *We have a product catalog available, so please check it out under "Download."
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![[Free Gift of 2 Booklets] RINCO Ultrasonic Pouch Sealer Product Catalog / UC Japan General Catalog](https://image.mono.ipros.com/public/catalog/image_generated/01/85b/321875/321875_IPROS3557555322044439716_1.jpg?w=120&h=170)
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
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