Widely used in fine anisotropic processing such as semiconductor, liquid crystal fine patterning, and DNA chip manufacturing.
You can choose a version that suits your needs, ranging from a manually operated research and development type chamber with atmospheric gates, transport mechanisms, and cassette stations to a fully automated system. We emphasize process reproducibility and standardly equip our systems with chillers for electrode temperature control and APC, and we can add turbo pumps compatible with high vacuum processes. 【Features】 ○ RIE plasma etching equipment ○ Capable of anisotropic etching of silicon wafers up to 6 inches and small square substrates ○ Equipment for 8 and 12 inches can also be designed For more details, please download the catalog or contact us.
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basic information
The Osaka headquarters is fully equipped with RIE devices for evaluation testing, and we accept process evaluation experiments at any time. We also offer technical introduction presentations and consultations on plasma applications. For more details, please feel free to contact our technical or sales department at the Osaka headquarters. For additional details, please download the catalog or contact us.
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Company information
Focusing on plasma and vacuum-related equipment, we respond to a wide variety of needs in various fields, including cleaning equipment and material handling. We also flexibly accept contract manufacturing for OEMs and other products beyond our own. Regarding plasma processing, we conduct joint research and development with other companies and universities in various fields, including electronics and medical applications. We also accept contract processing only. Leveraging our position as a manufacturer in design and other areas, we offer maintenance services for factory equipment, contract maintenance from equipment manufacturers, relocation of existing equipment, and refurbishment of used equipment, providing maintenance for various devices regardless of whether they are our own or from other companies.