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  1. Home
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  3. Scientific and Physics Equipment
  4. Surface Treatment Equipment
  5. Plasma surface treatment equipment
  6. Vacuum device for substrate parallel plate plasma processing equipment PC-RIE series

Vacuum device for substrate parallel plate plasma processing equipment PC-RIE series

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PC-RIE Series

last updated:Apr 19, 2017

電子技研
電子技研
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Processable substrate size 550×650 mm. Achieves zero waste liquid and low running costs.

The "PC-RIE series" can perform processing such as ashing, desmearing, surface modification, and F-type gas etching for medium-sized LCD substrates, printed circuit boards, and more. Customers can choose a version that suits their needs, ranging from a manually operated research and development type chamber to a fully automated system with an atmospheric gate, transport mechanism, and cassette station. 【Features】 ○ Vacuum plasma technology provides a better environment compared to conventional processing → Cleaning, no waste liquid ○ Low running costs ○ Usable substrate size: 550×650 mm For more details, please download the catalog or contact us.

    Vacuum EquipmentPlasma surface treatment equipment
denshigiken_rie.JPG

Vacuum device for substrate parallel plate plasma processing equipment PC-RIE series

denshigiken_rie.JPG
denshigiken_rie.JPG
  • Related Link - http://www.denshigiken.co.jp/contents/seihin.html

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basic information

Our Osaka headquarters is equipped with RIE devices for evaluation testing, and we accept process evaluation experiments at any time. We also provide technical introduction presentations and consultations on plasma applications. For more details, please feel free to contact our technical or sales department at our Osaka headquarters. 【Application Examples】 - Smear removal (desmear treatment) after laser processing is possible. - Plasma treatment of objects to improve electroless plating characteristics. - Hydrophilization of water-repellent resins such as Teflon, enhancing adhesion. - Improved adhesion for soldering and bonding. For more details, please download our catalog or contact us.

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Applications/Examples of results

【Applications】 ○ Desmear for printed circuit boards: Allows for the removal of smear after laser processing (desmear treatment). ○ Surface treatment before plating: Plasma treatment of the object improves electroless plating characteristics. ○ Surface modification (resin): Hydrophilization of water-repellent resins such as Teflon, enhancing adhesion. ○ Surface modification (metal): Improves adhesion for soldering, bonding, and similar processes. ● For more details, please contact us.

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Parallel Plate Type Vacuum Plasma Treatment Device PC-RIE Series (Vacuum Plasma Device)

Parallel Plate Type Vacuum Plasma Treatment Device PC-RIE Series (Vacuum Plasma Device)

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電子技研

電子技研

Industrial Machinery

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Focusing on plasma and vacuum-related equipment, we respond to a wide variety of needs in various fields, including cleaning equipment and material handling. We also flexibly accept contract manufacturing for OEMs and other products beyond our own. Regarding plasma processing, we conduct joint research and development with other companies and universities in various fields, including electronics and medical applications. We also accept contract processing only. Leveraging our position as a manufacturer in design and other areas, we offer maintenance services for factory equipment, contract maintenance from equipment manufacturers, relocation of existing equipment, and refurbishment of used equipment, providing maintenance for various devices regardless of whether they are our own or from other companies.

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