A book that I want to have on hand!
9,500 yen + tax offered at a standard price! ★ An essential book for handling thin films! ★ Explanations using as simple formulas as possible! ★ Includes over 30 Q&A to solve on-site troubles! ● Points for evaluating and analyzing surfaces and interfaces! ● Questions that can't be asked on-site & no one to ask ● How to deal with film peeling, detachment, and cracking? ● What constitutes a high-quality film and its manufacturing methods! ● Understanding the mechanisms of stress generation in thin film processes!
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Publication: October 2007, Price: 9,500 yen + tax Format: B5 size, 225 pages, ISBN: 978-4-901677-86-8 *For detailed content, please download the catalog.*
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Applications/Examples of results
Author Eiji Iwamura, Chief Researcher, New Business Planning and Development Department, Arakawa Chemical Industries, Ltd. ◆◇Examples of Q&A◆◇ (Published at the end) ●Fundamentals of Stress - Is the density of the film unrelated to stress? - How does the incorporation of gas impurities affect stress? - Is the mechanism of stress generation in plated films different from that in vapor-deposited films? ●Fundamentals of Adhesion - How does the handling of adhesion change when the film thickness reaches several tens of micrometers or several hundred micrometers? - Is the adhesive strength used with resin materials the same as the adhesion strength in thin films? ●Film Formation Process - How should plasma parameters be measured in plasma-assisted film formation? - What film formation parameters are related to the film formation rate? How does the film formation rate affect film stress? - Are there quality control methods to eliminate variations in stress and adhesion? ●Peeling and Adhesion Improvement - Cracks have occurred in the thin film. How should I address this? - Why does variation in adhesion occur between metal sputtered films? ●Other Troubles - Can device characteristics or film properties change due to film stress?
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