By pre-applying AuSn solder to the circuit board, it becomes possible to directly mount chip components, thereby reducing assembly labor.
【Features】 ○ AuSn composition: Au:Sn=7:3 (standard) (other compositions are also available) ○ Standard film thickness (t): 3μm ○ Film thickness tolerance: ±20% ○ Pattern minimum dimension (D): 50μm ○ Pattern tolerance: ±10μm ● For other functions and details, please contact us.
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basic information
Our company is equipped with a consistent manufacturing facility that covers everything from pattern formation of thin-film integrated circuits based on ceramic substrates to film deposition and dicing, catering to various circuit requirements. We have sputtering equipment, deposition equipment, dry etching equipment, and are also set up for mass production. Additionally, we accommodate various requests related to technology and delivery times for various circuits involved in development and research.
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Company information
As a member of JGC Group, JFC challenges the possibilities of the material of fine ceramics with our own technologies. We actively engage in fundamental and applied research on ceramics, product application development, as well as manufacturing and sales. We respond to the diverse needs of various advanced industries with our unique technologies and products, including high-frequency ceramic substrates and circuit components, ceramic parts for industrial machinery, and the prototyping and development of metal-ceramic composite materials (MMC).
