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  6. What are the key points for miniaturizing and further refining micro components?

What are the key points for miniaturizing and further refining micro components?

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last updated:Jul 28, 2016

愛工舎 七宗工場
愛工舎 七宗工場
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Publication of miniaturized and refined component processing technology for medical devices and semiconductor inspection parts!

We are considering miniaturizing our products, but we lack the manpower to process them in-house. If you are facing challenges such as being unable to respond technically, please consult with us. Aikosha specializes in NC precision machining and processes fine parts such as contact probes for electrical testing of fine components (semiconductors, printed circuit boards, etc.), medical device parts, and industrial equipment parts. With NC machining, we can handle fine parts with an outer diameter of "0.05 mm to 6.0 mm." In drilling operations, we have a technical track record of achieving a minimum hole diameter of "0.009 mm (depth 1.0 mm)," and we are committed to high-precision manufacturing. We are pursuing new fields where we can further utilize the fine processing technology and know-how we have cultivated over many years, particularly in semiconductor inspection parts. If you are considering further miniaturization or fine parts, please consult with us. Currently, we are partially showcasing examples of fine parts processing! *For more details, please download the catalog or contact us directly.

    Other semiconductorsProcessing Contract
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What are the key points for miniaturizing and further refining micro components?

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basic information

【Published Content】 ■ About NC Processing ■ About MC Processing ■ About Micro Parts Assembly ■ About X-ray Inspection *For details, please download the catalog.

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愛工舎

愛工舎 七宗工場

Manufacturing and processing contract

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We contribute to the growth of companies with world-class micro-manufacturing technology. Since our founding in 1934, we have accumulated micro-machining technology learned from manufacturing parts for spring-driven watches, responding to high precision demands. Today, we have developed the capability to process materials as thin as 1/50th to 1/100th of what was possible at that time. We will continue to challenge ourselves to create even thinner and more precise products in the future.

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