GOTO SEIKI Co., Ltd. - Precision Parts Processing

Added to bookmarks
Bookmarks list

Bookmark has been removed
Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.
Free membership registration

last updated：Apr 25, 2013

後藤精機

Official site

We respond to the growing demand for ultra-small precision parts processing in various fields.

GOTO Seiki Co., Ltd. specializes in the precision machining of extremely small components that are in high demand across various fields such as cameras, semiconductors, optical fibers, and connectors. We handle tiny parts ranging from about the size of a 10-yen coin to approximately the size of a grain of rice. Despite being small, our capabilities range from simple processes like drilling and grooving to complex shapes and three-dimensional forms. To achieve this, we create original mounting jigs and pursue positioning accuracy through repeated multi-process operations. Our cutting tools can combine to achieve a minimum radius of R0.05 and drilling diameters as small as Φ0.03, making the impossible possible. Burrs, which can be a significant issue during machining of tiny parts, are addressed through our pursuit of methods that eliminate them, and any remaining fine burrs are removed using our unique expertise. For more details, please contact us.

Related Link - http://www.gotoseiki.com/bisai.html

Inquire About This Product

basic information

**Features** - Supports ultra-small precision parts processing → Handles ultra-small parts from about the size of a 10 yen coin to around the size of a grain of rice → From simple tasks like drilling and groove processing to complex shapes and three-dimensional forms - Creates original mounting jigs to pursue positioning accuracy through repeated multi-processes - Uses cutting tools combined for "minimum R0.05, drilling Φ0.03" and similar specifications - Pursues processing methods that do not produce burrs, removing even fine burrs with unique know-how **Data** - 2D Data: DXF, DWG - 3D Data: IGS, STEP, Palasolid - Native Data: Unigraphics, One Space Designer, Top Solid **Processing Materials** - Metals → Aluminum, brass, magnesium, SUS, titanium, zinc alloys, copper alloys, especially ADC12 and ZDC2 for mass production die casting, and Beric keeps die casting plates for processing in stock at all times - Plastics → ABS, POM (including sliding grade and conductive grade), PC, PC-G, PET, PBT, PPS, PPS-G, PES, PMMA, PEEK, PP, PPE ● For more details, please contact us.