Achieving high-speed 3D/4D imaging measurements of nano-level dynamics!
By acquiring phase difference information of light using a holographic method, it is possible to instantaneously measure steep steps of a few micrometers without scanning, and display 3D images and surface roughness information. While achieving nanometer-level Z resolution, it eliminates the need for an anti-vibration table, allowing for high-speed measurement of large areas without requiring height direction scanning, enabling screening while displaying 3D images. This technology can be utilized not only in laboratories but also in manufacturing and quality control settings. ◆ Realizes high-speed data processing using holographic methods ◆ Nanometer-level height resolution ◆ Compatible with various measurement environments, including in liquids and through glass windows ◆ Easy setup and excellent operability ◆ No calibration required ◆ High-speed measurement of wide areas with stitching function (requires an automatic stage separately) ◆ Compatible with MEMS driven at high frequencies (requires a stroboscopic option separately)
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basic information
The DHM series enables rapid daily inspections, automated industrial quality control, and innovative research and development applications, particularly for dynamic observations, due to its high acquisition speed and ease of use. There are three configurations based on the number and combination of wavelengths: ● R-1000 Series: Single laser light source ● R-2100 Series: Dual laser light source ● R-2200 Series: Triple laser light source Please feel free to contact us for more details!
Price range
P7
Delivery Time
Applications/Examples of results
The Lyncee Tec DHM series is utilized in the following representative applications: ◆ Inspection of silicon wafer cutting surfaces for solar cells ◆ Observation of MEMS behavior ◆ Evaporation process of droplets ◆ Observation of high-speed wear tests ◆ Self-healing films If you are facing challenges with laser microscopes or white light interferometers, please feel free to consult us!
Detailed information
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MEMS Sensors Compatible with measurements from various MEMS sensors. It can capture information from the entire sample in a planar manner, not just at specific points, allowing for significantly more information regarding motion compared to conventional methods, enabling diverse and flexible analysis.
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MEMS Sensors Supports measurements of various MEMS sensors. It can capture information across the entire specimen in a planar manner, not just at specific points, allowing for significantly more information regarding motion compared to conventional methods, enabling diverse and flexible analysis.
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Inspection of the cutting surface of silicon wafers for solar cells By customizing image acquisition and analysis software for short time periods, high throughput quality control from "upstream (lab) to downstream (site)" becomes possible. In the case presented, the depth of machining marks on the solar cell wafers created during cutting from bulk silicon is measured in a short time, ensuring that the surface roughness is within the specified values.
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Evaporation Process of Liquid Droplets on Silicon Wafers After dropping water droplets on a silicon wafer, the drying process is observed. The drying process, which occurs instantaneously with high vertical resolution, is captured through 3D imaging. The thin film state, stains, and residues before the droplet ultimately disappears can also be observed. Additionally, since the information is obtained in three dimensions, the contact angle and displacement of the contact line at any arbitrary location can be determined.
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In-situ observation of the wear process The objective lens was used while immersed in lubricating oil to observe the wear process in situ. Changes occurring with each cycle were continuously tracked, including not only wear but also the peeling of the surface film. The video shows that as the number of cycles increases, the wear marks grow deeper and spread laterally. Due to its nano-order vertical resolution, it is capable of detecting shallow scratches on hard materials.
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Company information
Our company was established as the Japanese subsidiary of a foreign-affiliated manufacturer with a global network spanning over 40 countries. We are steadily expanding our business primarily through the sale of SQUID magnetic property measurement devices and physical property measurement devices, which boast a world-class share in the field of new material research and development. Additionally, we also operate as a trading company for high-tech scientific instruments, importing and selling cutting-edge research equipment from around the world in various fields such as material science, biotechnology, and nanotechnology. The wave of technological innovation is significantly transforming not only industrial sectors but also our daily lives. Among these, the fields of material science, biotechnology, and nanotechnology, which are the pillars of our business, can be described as "core technologies" that provide humanity with infinite possibilities for the future as they lead the way in cutting-edge technology (high-tech). The discovery of high-temperature superconducting materials, applications of laser microfabrication and optical communication, and surface analysis at the nanoscale are already playing important roles in various fields such as new materials, semiconductors, information and communication, medical care, clinical diagnostics, and drug discovery, while also enabling further advancements in technology.