This is a substrate with unique high heat dissipation properties developed by Daiwa Kogyo Co., Ltd.
"DPGA" stands for "Daiwa Process Global Advance," which is a process developed independently by Daiwa Industrial that uses metal Cu bumps for interlayer wiring connections. A substrate with high heat dissipation characteristics enables high brightness and long lifespan of LEDs, as well as miniaturization of heat sinks. 【Features】 ○ Interlayer connection using metal pillars (copper bumps) → Achieves low resistance, high connection reliability, and high thermal conductivity ○ Copper bumps can be of any shape and size → For cylindrical shapes, diameters can range from 0.3 to 4.00 mm ○ Mixing of copper bumps of different sizes is possible ○ Improved thinness, lightness, and rigidity → Minimum board thickness: 0.3 mm, using prepreg for the insulation layer ○ Maximizes the functionality of LEDs → Ideal for LED substrates (liquid crystal panels, lighting) and automotive substrates For more details, please contact us or download the catalog.
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【Implementation Example】 [For Double-Sided Boards] ○ Board Thickness: 0.3mm ○ Insulation Layer Thickness: 0.06mm (Prepreg) ○ Minimum L/S: 150μm/150μm ○ Minimum Via Land Diameter: 600μm ○ Minimum Via Land Pitch: 0.75mm [Metal (Copper) Base Board, Single-Sided, 1 Layer] ○ Copper Plate Thickness: 0.6–1.5mm ○ Insulation Layer Thickness: 0.06mm (Prepreg, High Thermal Conductivity Resin) ○ Minimum L/S: 125μm/125μm ○ Minimum Via Land Diameter: 450μm ○ Minimum Via Land Pitch: 0.575mm ● For more details, please contact us or download the catalog.
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Applications/Examples of results
【Usage】 ○LED (package substrate, motherboard), power supply ●For more details, please contact us or download the catalog.
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With the diversification and high performance of products, electronics are rapidly advancing towards high performance and high heat dissipation. They are used in various applications such as televisions, computers, and digital cameras, and are not only common products but also widely utilized as core components in medical devices and information communication equipment. In addition to the obvious requirements of QCD (Quality, Cost, Delivery), the importance of environmental pollution countermeasures is increasing, making it urgent to address these issues. To meet the needs of a changing era and as a means to tackle environmental problems, Daiwa Industry Co., Ltd. has developed and patented its unique technology "DPGA (New AGSP)" and is providing this technology to the industry, continuously working towards making it the industry standard. As a first step to address environmental issues, we have achieved energy-saving solutions through high heat dissipation substrates. We offer technologies and products that can accommodate various solutions, including heat dissipation, and can provide a consistent solution from prototype to mass production. We look forward to your continued support for Daiwa Industry's DPGA.