Ultrasound is excellent for sealing mixed materials! 'RINCO Ultrasonic Pouch Sealer Machine'
【Free sample testing available】 Welding of widths from 1mm to 10mm can be done at once, even during food chewing! Instant welding with power activation.
This is a sealing device specialized for filling and packaging of food and chemical products. It ensures high sealing strength even during filling when liquid drips or when there is biting into the sealing surface due to static electricity. The challenges of heat sealing have been overcome with ultrasonic sealing. 【Features】 ■ A one-head solution replacing the heat sealing and cooling process ■ Ensures sealing strength even when biting into liquids (oils, detergents) and solids (food) ■ No need for Teflon sheets/cooling heads for ultrasonic tools ■ No scorching of heat plates or adhesive residue ■ No need for temperature controllers or cartridge heater replacements Improved yield, along with savings on packaging and electricity costs, and simplified maintenance! We can accommodate various packaging materials, so please consult us first. ☆ On the first day of JapanPack, 10/13 (Tuesday) from 12:00 to 12:30, we will have a presentation at the booth of our cooperating manufacturers. We will provide details to customers who inquire. For more information, please contact us or download the catalog. We will send a YouTube link to reference videos to those who reach out.
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basic information
Swiss RINCO Ultrasonic AG is a manufacturer of ultrasonic welders specializing in the welding and cutting of thin films and non-woven fabrics, resin welding, and metal joining. Swiss Artech Ultrasonic AG is a manufacturer of ultrasonic sieving devices specializing in ultrasonic powder sieves, ultrasonic hoppers, and ultrasonic knives. They are sister companies of our company, UC Japan Co., Ltd., and part of the same group. *We have product catalogs available, so please download them for your review.
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Detailed information
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RINCO Ultrasonic Pouch Sealer Seal Strength Test
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RINCO Ultrasonic Pouch Sealer Sealing surface with logo
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.