Inspection of 300mm wafers can be performed in less than one second for the entire field of view in a single shot.
【Device Overview】 It is capable of inspecting 300mm wafers in less than one second for the entire field of view in a single shot. Due to the short inspection time, it is also adopted in fully automated inspection lines. It starts with a small field optical system and can be applied to internal void inspections by using infrared as an optional light source. In recent years, wafers have been getting thinner, but this is a high-precision wafer crack inspection device that quickly inspects the entire field of view for issues such as the unevenness of BG processing, polishing marks, and chip cracks caused by stress. 【Device Features】 In addition to automatic inspection, a standalone type is also available, allowing for manual inspection. It can set any slice level, enabling inspections tailored to specific needs. Depending on the application, it also has a function for removing so-marks, automatically extracting defect components excluding polishing marks. 【Device Applications】 ● Patterned wafer crack inspection ● Bare wafer crack inspection ● Wafer edge damage inspection ● Evaluation of BG polishing marks ● Evaluation of slurry ● Residual stress in glass substrates ● Evaluation of stress relief ● Tension inspection of BG tape ● Inspection of distortion and scratches on compound wafers
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basic information
【Device Overview】 It is capable of inspecting 300mm wafers in less than one second for the entire field of view in a single shot, and due to the short inspection time, it is also adopted in fully automated inspection lines. It is available with a small field of view optical system, and by using infrared as an optional light source, it can be applied to internal void inspections. In recent years, wafers have been getting thinner, but this is a high-precision wafer crack inspection device that quickly inspects the entire field of view of wafers for issues such as the unevenness of BG processing, polishing marks, and chip cracks caused by stress. 【Device Features】 In addition to automatic inspection, a standalone type is also available, allowing for manual inspection. It can set arbitrary slice levels, enabling inspections tailored to specific needs. Depending on the application, it also has a function to remove surface marks, automatically extracting defect components excluding polishing marks. 【Device Applications】 ● Patterned wafer crack inspection ● Bare wafer crack inspection ● Wafer edge damage inspection ● Evaluation of BG polishing marks ● Evaluation of slurry ● Residual stress in glass substrates ● Evaluation of stress relief ● Tension inspection of BG tape ● Inspection of distortion and scratches on compound wafers
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Applications/Examples of results
● Patterned wafer crack inspection ● Bare wafer crack inspection ● Wafer edge damage inspection ● Evaluation of BG polishing marks ● Evaluation of slurry ● Residual stress in glass substrates ● Evaluation of stress relief ● BG tape tension inspection ● Inspection of distortion and scratches on compound wafers ■ Micro-pipes inside the wafer ■ Delamination inside the wafer ■ Surface scratch inspection, polishing mark inspection ■ Foreign object inspection (including internal) ■ Measurement of surface roughness and pattern slope (optional AFM) ■ Inspection of scratches, pits, and bubbles ■ Non-contact thickness measurement (optional thickness gauge) ■ Micro-cracks, pinholes ■ General appearance inspection and others
Company information
We provide manufacturing equipment sales, proposals, and services unique to a "technical trading company" that has design know-how and contract/manufacturing partners. We have accumulated achievements through experiments and development with optimal selections tailored to our customers' needs. We will continuously develop new innovative technologies and applied technologies. We offer high-value-added proposals that encompass equipment sales, contract rental services, and consumable parts sales.
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